AIM’s Timothy O’Neill to present at the SMTA Upper Midwest Expo & Tech Forum on June 22nd, 2017

AIM Solder, a global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Timothy O’Neill, Technical Marketing Manager, will present at the SMTA Upper Midwest Expo & Tech Forum, scheduled to take place on June 22nd, 2017 at the DoubleTree by Hilton Minneapolis – Park Place Hotel in Minneapolis, MN. Additionally, AIM will highlight its revolutionary REL61™ lead-free solder alloy, along with its full line of solder assembly materials.

O’Neill will present the white paper “Benefits and Implications of Finer Mesh Solder Powder,” at the technical forum. This study evaluates the benefits and implications of finer mesh solder powder on various aspects of solder paste performance. Some of the studied variables include print transfer efficiency, print life, wetting, coalescence and process stability.

AIM will also highlight its innovative high reliability, lead-free solder alloys. REL61 addresses the most challenging issues with today’s common lead-free alloys, specifically BTC voiding, cost, durability and tin whiskers. It offers a low cost alternative to SAC alloys, with reliability and performance characteristics superior to SAC305 and other low/no-silver solder alloys. REL22™ is a high reliability, high strength lead-free solder alloy for extreme service environments, with reliability equal to Sn/Ag/Bi/Sb/Ni/Cu and a wider process window. To discover all of AIM’s products and services, visit the company at the SMTA Upper Midwest Expo & Tech Forum for more information.

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