IPC extends deadline on call for participation for IPC APEX EXPO 2018

Deadline for technical conference paper abstracts extended to: July 21, 2017

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2018 to be held at the San Diego Convention Center. Professional development courses will take place February 25, 26 and March 1, 2018 and the technical conference will take place February 27–March 1, 2018. The extended deadline for technical conference abstracts is July 21, 2017.

The industry’s premier conference and exhibition for the electronic interconnection industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Ericsson, Flex, IBM, Indium, Intel, MacDermid-Enthone and Robert Bosch have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”

Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:

3D Printing in Electronics Manufacturing
Automation in Electronics Manufacturing
Advanced Technology
Area Array/Flip Chip/0201 Metric
Assembly and Rework Processes
BGA/CSP Packaging
Black Pad and Other Board Related Defect Issues
BTC/QFN/LGA Components
Business & Supply Chain Issues
Conformal Coatings
Counterfeit Electronics
Electronics Manufacturing Services
Embedded Passive & Active Devices
Environmental Compliance
Graphene in Electronics Manufacturing
Lean Six Sigma
LED Manufacturing
Failure Analysis
Flexible Circuitry
HDI Technologies
Board and Component Warpage
High Speed, High Frequency & Signal
Industry 4.0
Lead-Free Fabrication, Assembly & Reliability
Miniaturization Nanotechnology Optoelectronics
Packaging & Components
PCB Fabrication
PCB and Component Storage & Handling Performance
Quality & Reliability
PoP (Package-on-Package)
Printed Electronics
RFID Circuitry
Surface Finishes
Test, Inspection & AOI
Tin Whiskers
2.5-D/3-D Component Packaging
Via Plugging & Other Protection

An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.
In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials.
Technical conference paper abstracts are due July 21, 2017 and course proposals are due August 18, 2017. To submit an abstract or course proposal, visit www.IPCAPEXEXPO.org/CFP


Start typing and press Enter to search