Microtronic GmbH to introduce heavy duty solderability tester at SMT Hybrid Packaging

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Microtronic GmbH, a leading sales specialist of microelectronics, is pleased to announce that it will introduce its new LBT210-HD (Heavy duty) Solderability Tester in Stand 221J in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany. Microtronic remains the technology leader with the only heavy duty automatic and PC-controlled solderability tester. The revolutionary system is designed to meet today’s current industry challenges, accommodating heaver or larger parts that will not fit existing testers.

With the launch of the LBT210-HD, the maximum weight of a part that can be tested is now for forces up to 300mN instead of 40mN on the standard LBT210. Ernst Eggelaar, President of Microtronic commented, “This will be a major step for customers that could not test large parts or connector pins in the past. Previously there were not any systems designed to handle larger parts. Now Microtronic can offer this.”

The system is operated by using molten solder and measures the wetting force of the molten solder to the test part. This ensures a true value of the solder process. The system supports measurements using the common methods with a solder bath or a solder globule. All industry standards including IPC, IES, NF, MIL and JEDEC are supported.

For more information about Microtronic or to schedule a demonstration, visit www.microtronic.de

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