SMT Hybrid Packaging 2016: Conference program characterized by Industry 4.0
This year, the German conference of SMT Hybrid Packaging 2016 focuses on Industry 4.0. The delegates receive professional expert knowledge at first hand: On the second event day the conference informs about “Aufbautechnologien für intelligente Sensorsysteme – Voraussetzung für das Internet der Dinge” – mounting technologies for intelligent sensor systems. On the following day the delegates learn more about future developments in the industry regarding “Baugruppenfertigung 2020 – Umsetzung mit Industrie 4.0“ – assembly production 2020.
“PCBA Failure Analysis and Reliability Testing of Electronic Assemblies” is the title of a workshop presented in cooperation with the SMTA – Surface Mount Technology Association. It provide svaluable lessons learned from practical experience through discussion of material selection, current electronics research and failure analysis case studies. The second part focuses on the reliability of lead free solders, surface finishes and LF laminates.
The first part of the workshop “Printed Electronics Opportunities for the EMS Supply Chain” on the first event day focuses on topics around production, processes and markets. In the second part the delegates discuss the integration of printed electronics into assembly production.
Additionally, on the first event day the program features five English tutorials. Dr. Ning-Cheng Lee of Indium Corporation presents “DFX for Advanced Soldering Technology”. Part 1 in the morning focuses on Design for Manufacturability (DFM), Part 2 in the afternoon informs about Design for Reliability (DFR). Dr. Jennie Hwang of H-Technologies Group provides valuable information on „Reliability of Electronics – the Role of Intermetallic Compounds” in the morning and on “Preventing SMT Assembly Defects and Product Failures” in the afternoon.
SMT Hybrid Packaging takes place from 26 – 28 April 2016 in Nuremberg.