APEX 2017 – Facebook Live Panel Discussions (Schedule with World Time)

https://facebook.com/globalsmt

Tuesday, February 14th

Live from APEX  
Trevor Galbraith and David Burford reveal some of the highlights at the show.

San Diego Denver Chicago New York London Frankfurt
9:00 AM 10:00 AM 11:00 AM 12:00 noon 5:00 PM 6:00 PM

 

Turning inspection data into actionable instructions
The challenge to harness the power of inspection systems to provide accurate, actionable data to assist process improvement continues. This debate brings together the leading minds in the industry to provide an update on the latest technologies and challenges.

Panel: Brian D’Amico (MIRTEC), Sean Langbridge (CyberOptics), Harald Eppinger (Koh Young)

San Diego Denver Chicago New York London Frankfurt
10:00 AM 11:00 AM 12:00 noon 1:00 PM 6:00 PM 7:00 PM

 

Selective soldering – do’s and don’ts
The SMT process has accelerated the use of selective soldering systems alongside, or sometimes replacing wave soldering systems. Miniaturization and the high-mix environment have provided a number of process challenges. This panel will discuss these challenges and the range of new features, capabilities available to optimize production.

Panel:  Andreas Reinhardt (SEHO), Alan Cable (ACE), Eddie Groves (Pillarhouse), Ernie Grice (kurtz ersa)

San Diego Denver Chicago New York London Frankfurt
11:00 AM 12:00 noon 1:00 PM 2:00 PM 7:00 PM 8:00 PM

 

The Keith Bryant Show
Global roving reporter Keith Bryant discusses some of the latest technology and industry updates with a variety of technology experts at APEX.

San Diego Denver Chicago New York London Frankfurt
12:00 noon 1:00 PM 2:00 PM 3:00 PM 8:00 PM 9:00 PM

Wednesday, February 15th

Live from APEX
Trevor Galbraith and David Burford reveal some of the highlights at the show.

San Diego Denver Chicago New York London Frankfurt
9:00 AM 10:00 AM 11:00 AM 12:00 noon 5:00 PM 6:00 PM

 

IPC Connected Factory Initiative – how will it work?
Since the inaugural meeting of the IPC Connected Factory Initiative, the committee has made major strides towards launching an initial standard for machine to machine communication within the ‘smart factory’. This panel will discuss the new standard and plans for its future development and support.

Panel:  Dan Gamota (Jabil), Jason Spera (AEGIS), Oren Manor (Mentor Graphics)

San Diego Denver Chicago New York London Frankfurt
10:00 AM 11:00 AM 12:00 noon 1:00 PM 6:00 PM 7:00 PM

 

How much intelligence can you pack into a pick ‘n place machine?
Pick and place is at the heart of every production line. Machine uptime is critical to maximizing yield and integration with inspection systems optimize quality. This panel will take a deep look at the key roles pick and place machines performs today and the likely role it will play in smart factories in the future.

Panel: Jeff Timms (ASM), Shawn Robinson (Panasonic), Richard Verjeissen (Yamaha)

San Diego Denver Chicago New York London Frankfurt
11:00 AM 12:00 noon 1:00 PM 2:00 PM 7:00 PM 8:00 PM

 

The Keith Bryant Show
Global roving reporter Keith Bryant discusses some of the latest technology and industry updates with a variety of technology experts at APEX.

San Diego Denver Chicago New York London Frankfurt
12:00 noon 1:00 PM 2:00 PM 3:00 PM 8:00 PM 9:00 PM

Thursday, February 16th

Live from APEX
Trevor Galbraith and David Burford reveal some of the highlights at the show.

San Diego Denver Chicago New York London Frankfurt
9:00 AM 10:00 AM 11:00 AM 12:00 noon 5:00 PM 6:00 PM

Making reflow ovens smart
Reflow ovens have become more sophisticated and dynamic in recent years, with capabilities to reduce voiding and optimization to reduce energy consumption and control the temperature flow to produce improved profiles and reliability. This panel will discuss the latest technologies affecting reflow ovens.

Panel: Fred Dimock (BTU),  Michael Hanke  (Rehm), Maximilian Leppig (SMT Wertheim)

San Diego Denver Chicago New York London Frankfurt
10:00 AM 11:00 AM 12:00 noon 1:00 PM 6:00 PM 7:00 PM

 

Dispensing, potting and encapsulation challenges
Miniaturization and 3D assemblies continue to present manufacturing challenges to package assemblers. Likewise, material characteristics such as viscosity, needle drip, outgassing of air bubbles etc., present process challenges. These production issues will be discussed by our expert panel.

Panel: David Edwards (Henkel), Heakyoung Park (Nordson ASYMTEK), Nico Coenen (MYCRONIC)

San Diego Denver Chicago New York London Frankfurt
11:00 AM 12:00 noon 1:00 PM 2:00 PM 7:00 PM 8:00 PM
..... [related_posts_by_tax]
0

Start typing and press Enter to search