Register now and learn about new assembly technology, growing yield and increasing reliability. This global conference is a strong technical three-day event focused on today’s most important and timely issues in electronics manufacturing.
When Coating Hits the Fan – Consequences of Poor Ruggedization
Jason Keeping, P.Eng., Celestica, Inc.
Recent Advances and New Trends in Semiconductor Packaging
John Lau, Ph.D., ASM Pacific Technology
IoE-Next Generation Supply Chain Ecosystems
Nasrudin Bin Abdul Muthalib, Cisco Systems (Malaysia) Sdn. Bhd.
- Cleaning of No Clean Flux Residues
- Cleaning Challenges for Board Assemblies
- Enhancing Assembly and Test Processes
- Design and Manufacturing
- Inspection and Quality
- Advanced Packaging
- Paste, Printing and Soldering
Workshop 1: Robust Coating Processes in the Factory:
Methods, Critical Parameters, Problems and Remedies
Instructor: Jason Keeping, P.Eng., Celestica, Inc.
Workshop 2: Choosing Solders for the New Era Part 1 – Low Cost High Reliability Lead-Free Solder Alloys
Instructor: Ning-Cheng Lee, Ph.D., Indium Corporation
Workshop 3: Fan-Out Wafer-Level Packaging and 3D Packaging
Instructor: John Lau, Ph.D., ASM Pacific Technology
Workshop 4: Choosing Solders for the New Era Part 2 – It is Time for Low Temperature: Low Temperature Solders, New Development
and Their Applications
Ning-Cheng Lee, Ph.D., Indium Corporation
SMTA Penang Chapter 10th Anniversary Celebration
Come join us for drinks, dinner and trivia as we celebrate this milestone!
Please register so we can plan accordingly for the dinner.