SMART Group Events Calendar

Component & PCB Failures Caused by MSD & update on ESD Control

When: February 22, 2017 @ 10:00 am – 4:00 pm
Where: Henkel Hemel Hempsted
Hemel Hempstead HP2 4RQ
Cost: £85.00 – £175.00 Non Member plus VAT
Contact: Keith Bryant

Our workshop will be held at Henkel in Hemel Hempsted starting at 10.00am with coffee at 9.30am

The electronics industry is going through seismic shifts when looking at component size reduction and increase power complexity in the production process, this is coupled with ever increasing demands for lower costs. One way to reduce costs is to use slightly cheaper PWBs and unsealed or cheaper components and not worry about basic handling controls. Alternatively just buy larger volumes of existing components to achieve a more cost effective volume cost. These solutions can potentially increase the risk for moisture absorption and also potential reduce the products ability to withstand moisture absorption. This can have a disastrous effect on the long-term life of components and finished products

At the same time components are becoming more susceptible to ESD damage. An new version of the ESD control standard IEC 61340-5-1:2016 shows some changes that reflect this increasing sensitivity. Low moisture conditions tend to maximise Electro Static Discharge (ESD) risks and packaging must often protect against ESD as well as moisture

This presentation will cover what moisture sensitivity levels (MSL) mean and what effects they have, also what can be used to increase the lifetime of components and PWBs by improving storage and handling. The event will also look at changes in the 61340-5-1:2016 ESD standard and the overlapping area of MSD and ESD protective packaging. This event will be very practical in nature with good interaction and examples of ESD and MSD controls and failures

For information on the workshop and booking your place please Click Here

To book a table top exhibition space Click Here

It will be useful to all people involved in the production process from purchasing, stores all the through to production engineers and test, the event it will cover:

MSL definition
MSL testing
ESD failures and procedures
ESD specifications and handling
IPC and industry specifications
Effects of moisture on components and PWBs
Common defects seen in manufacture
How proper storage can overcome these issues
True impact on your company of failure

Guide to Printed Circuit Board Manufacture – smart-e-webinar

When: March 15, 2017 @ 2:30 pm – 3:30 pm
Where: Online Webinar
Cost: £65 plus VAT
Contact: Keith Bryant
00 44 7946133531

How is a printed circuit board made and what can impact the quality and reliability during assembly? For those new to the circuit industry, and ideal for purchasing teams, design and assembly engineers this webinar covers the manufacturing process for modern printed circuit boards. The session provides a clear step by step guide modern circuit boards and the correct rules for cost effective manufacture


After the webinar there is a Q&A session which provides ample time for all delegate questions to be answered. However, if a delegate has a process example they would like cover in the webinar it will need to be provided in advance of the session

Each webinar last approximately 60-90mins with the opportunity for questions

To book your webinar place Click Here

Topics covered:

Printed board manufacture
Single & double sided
Multi layer
Laminate selection
Plating processes
Solder resist
Solderable finishes, gold, copper, silver
Inspection criteria and process defects
Microsectioning of PCBs
Storage & packaging

Computer Tomography from Micro Electronics to Assembled Products – smart-e-webinar

When: April 5, 2017 @ 2:30 pm – 4:00 pm
Where: Online Webinar
Cost: £65 plus VAT
Contact: Keith Bryant
Traditional CT in our industry has been limited to Business card sized samples, due to the Cone Beam x-ray systems used by Electronics manufacturing companies. Inclined or Partial CT provides a slightly different solution showing layers or slices in 2D very well, but due to the partial nature of the scans does not produce very accurate 3D reconstructions
This webinar will look at more sophisticated x-ray systems, including dual tube units, which can image at sub-micron level and have the ability to build an accurate and detailed 3D image of a tablet or smart phone without any stitching or joining of images. With high quality reconstruction software, these images can easily be manipulated to allow key features or failure sites to be easily seen. These systems are being used in Failure Analysis but also in NPI and in the design and development process as CAD data can be overlaid and metrology is also possible with some systemsFor further information or to book a place Click Here
Presented by Keith Bryant
Topics include:
CT meets CAD and Metrology
New systems cross over from Sub Micron to assembled Smart Phones and beyond
Images from micro electronics to complete assemblies
Very detailed 3D reconstruction, perfect for FA

A copy of the slides will be provided after the webinar and there is also a opportunity for Q&A during the session

Contamination, Cleaning & Conformal Coating Conference

When: May 23, 2017 @ 9:00 am – May 24, 2017 @ 4:30 pm
Where: Radisson Blu Hotel
Contact: Keith Bryant
00 44 7946133531

The event is jointly organised by SMTA & SMART Group
smta-smartSMTA and SMART Group are excited to announce their first-ever co-organized conference in Europe. The conference focus is on contamination, cleaning and conformal coating in the manufacture of electronics. Be part of this two-day event featuring presentations, workshops, and a panel discussion.  The event will be held 23-24th May at Radisson Blu Hotel Amsterdam Airport Schiphol


Submit an abstract!

The Technical Committee would like to invite you to submit an abstract for this program. Deadline for submittal is December 16, 2016. Show off your company’s expertise and knowledge.

Abstracts can be submitted quickly and easily from the Call for Papers page


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