Tin Whisker Mitigation Methodologies 24th November 2016 @ 10 am
Tin Whisker Mitigation Methodologies
24th November 2016 @ 10 am – 3:30 pm
Holywell Park, Loughborough University
Since the introduction of the RoHS legislation in 2006, the threat of tin whisker related short circuit failure from pure tin finished components has remained as a major concern within the high reliability electronics manufacturing industry. But how do we set about mitigating against such failure where the use of pure tin finished components is unavoidable?
This seminar is aimed at answering this question, providing a series of technical presentations that will capture current thinking regarding whisker mitigation.
Seminar Topics will include: –
An Overview of Problems associated with Tin Whisker Growths and Management of Mitigation Processes
Dr Barrie Dunn
BD Consulting / University of Portsmouth
Tin Whisker Mitigation – Research into Mechanisms & Strategies Part 1 – Effect of Plating Methodologies
Dr Mark Ashworth
Evolution of Mitigation Methods via Technical Standards
MBDA Missile Systems
Mitigation of Tin Whiskers on Printed Circuit Assemblies
National Physical Laboratory
Practical Aspects of Tin Whisker Mitigation
Controls and Data Services Tin Whisker Mitigation – Research into Mechanisms & Strategies Part 2 – Post-Plating Mitigation Methods
Dr Mark Ashworth
Hot Solder Dipping for Tin Whisker Mitigation
Who should attend?
These events are ideally suited to any member of staff in electronics manufacturing or design who wish to improve their knowledge of the issues surrounding tin whiskers and current thinking concerning mitigation techniques. Managers and non-engineering support staff will also benefit from a fuller understanding of the issues involved.
Cost per delegate will be £85 for SMART Group Members and £175 for non-members.
c/o 77 Mill Road