Webinar: Ball Grid Array, Bottom Mounted Component Design, Assembly, Inspection & Defect Elimination

 In

November 13 @ 2:30 pm4:00 pm | £65

BOOK A PLACE FOR THIS ONLINE WEBINAR

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This webinar includes all BGA (Ball Grid Array), BMC (Bottom Mounted Components), PoP (Package On Package) component assembly and process setup with inspection methods and common failure detection and elimination. Bob produced the first training videos, interactive CDs on area array technology and the first book on PoP assembly and soldering

Bob’s session features many unique process video clips on testing and failures and make his sessions come alive providing a much better understanding of the root cause of failure and corrective action. A FREE copy of Bob’s Ebook on PoP is available to delegates and a copy of his area array posters is provided to each engineer attending this course

If you have a specific process problems with reflow send it to Bob to include in the webinar

Presented by Bob Willis

Topics will include:

  • Package types
  • Design and PCB guide lines for parts
  • Assembly process options
  • Inspection standards & reliability
  • Common process and reliability failures
  • Defect Investigation techniques and corrective action

A copy of the slides presented during the webinar are provided at the end of the event plus a link to a text book on PoP assembly and inspection wall charts for QFN inspection

Details

Date: November 13
Time: 2:30 pm – 4:00 pm
Cost: £65
Venue: Online Webinar in United Kingdom
Organiser: Bob Willis
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