APEX Heads Back to Vegas!
IPC APEX Expo returns to the bright lights of Las Vegas next month. The leading US PCB and electronics manufacturing conference and exhibition will be held in South Halls 1 and 2 in the Las Vegas Convention Center, March 15-17. This is the first time it will be held in this location.
The event will feature the usual array of standards and committee meetings, professional development courses etc., supported by a full technical conference. For details of this year’s schedule, please visit www.ipcapexexpo.org/html/ schedule/default.htm
The free keynote events this year are presented by Dean Kamen on Tuesday, March 1. His presentation is “Inventions and Innovations”. Something he is well-known for as the inventor of like the Segway, the IBOT wheelchair, a portable water purification system and the first wearable insulin pump for diabetics.
Wednesday’s keynote will be presented by Peter Singer, strategist and Senior Fellow at the New America Foundation. Singer will discuss how fiction is quickly becoming reality in his presentation :Rise of the Warbots”.
On the show floor there are equally exciting things happening. Here are just a few of the many new product introductions you can see this year:
Acculogic – BOOTH #1623
Company representatives will demonstrate the FLS980 Series III and the new Scorpion Briz Test & Programming station.
The FLS980 Series III with the Ultimate Accuracy Package Option along with high throughput features such as the latest version Flying Bed of Nails (FBON). The new ThermoScan thermal imaging test solution and MicroScan miniature image observation and testing solutions also will be displayed.
The Scorpion Briz is a compact, totally customizable, all-in-one test station. It can be configured to perform in-circuit, functional and boundary testing, and in-system programming. As a result, in one manufacturing stage users can achieve the highest level of test coverage, perform device programming, and meet and exceed throughput requirements. This makes the Scorpion Briz a truly affordable tester.
temperature point during reflow and for the combined data set. Data to be analyzed can be collected with any of the 200+ TherMoiré systems in use throughout the worldwide electronics supply chain today. Introducing unique features such as Pass/Warning/Fail maps, as well as graphical results identifying problem areas based on user inputs, Interface Analysis allows users to see what is happening between two dynamic surfaces throughout the entire reflow process.
Akrometrix – BOOTH #1623
Company representatives will discuss Akrometrix’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.
The Akrometrix Interface Analysis software enables 3D, 2D and statistical review of the complete interface at each
Alpha- BOOTH #2500
Alpha Assembly Solutions will debut material set combinations to include paste, tacky flux, cored wire and wave soldering flux that are tested with one another to achieve greater reliability.
This year there will be particular focus on ALPHA Solder Paste & Preforms for Optimized Process Solutions and ALPHA Wave Solder Alloy & Chemistries and Cored Solder Wire for Optimal Performance. ALPHA Recycling Services will also be highlighted at the show this year to help customers realize their options for responsibly disposing of solder dross and waste.
In addition, Alpha will be presenting two technical presentations during IPC APEX this year:
• Effect of Alloy and Flux System on High Reliability Automotive Applications, Presented by Mitch Holtzer, Tuesday, March 15/1:30p.m.-3:00p.m.
• Divergence in Test Results Using IPC Standards SIR and Ionic Conta-mination Measurements, Presented by Karen Tellefsen, Wednesday, March 16/1:30p.m.-3:00p.m.
BTU – BOOTH #1837
BTU will showcase its Recipe Pro recipe generator software, jointly developed with Electronic Controls Design Inc. (ECD), as well as highlight the latest version of the Energy Pilot software and Industry 4.0 compliant solutions.
Integrating ECD’s recipe generator technology into BTU’s advanced reflow systems offers manufacturers a streamlined and effective approach to initial recipe generation for higher yield results. The profiler will reduce non-productive time by streamlining the set-up process. Recipe Pro is the only recipe generation tool in the industry to include convection rate in the recipe generator algorithm, pairing it perfectly with PYRAMAX’s closed loop convection control.
Energy Pilot is a feature in the latest release of BTU’s windows-based WINCON operating system. The Energy Pilot software saves manufacturers money whenever the oven is idle. Standby mode can save more than 25 percent. Sleep mode can be used for longer interruptions saving more than 40 percent. Long idle periods fully shut down the oven using hibernate mode. Recovery times are minimized using remote product sensors and SMEMA. Operation is fully automatic and results in an overall reduction in electrical, air and nitrogen consumption. The feature is easily upgradeable on older BTU reflow ovens.
Cogiscan – BOOTH #2325
Cogiscan Inc. will highlight the latest version of its Factory Intelligence Software. Factory Intelligence is a powerful tool designed to drive continuous improvements in operational efficiency. This is accomplished by real-time monitoring of all operations through the use of intuitive and meaningful dashboards presenting Key Performance Indicators (KPIs).
The new Cogiscan Factory Intelligence also will be demonstrated in the Juki booth #763. This new module is a simple add-on to the Juki total line TTC software solution that also is developed by Cogiscan.
Computrol – BOOTH #1546
Computrol representatives will discuss high-mix electronic manufacturing and lot traceability capabilities.
Utilizing state-of-the-art manufacturing equipment and processes, Computrol focuses on prototyping and low to medium volume, high-mix production of PCB, box build, cable harness and backplane assemblies. The company’s world-class team has the experience to make any design project a success.
Computrol is certified to ISO 9001-2008, ISO 13485 specific to medical device quality systems, AS9100 specific to military and aerospace quality systems, IPC class II and III and J-Std certified as well as being ITAR registered and lead-free RoHS compliant.
Count on Tools (COT) – BOOTH #2801
COT will display the new QWIKTRAY system, which has been developed to provide low-cost, custom matrix trays for many types of electroniccomponents. The QWIKTRAY platform allows surface mount components to be picked up in a repeatable method when tape-and-reel is not available and standard JEDEC trays do not exists. Customers no longer have to place these components by hand.
Utilizing the latest in machining and additive manufacturing technologies, QWIKTRAY will develop a custom pocket design matched to your component specifications and machine it into a finished matrix tray. QWIKTRAYs can be designed for almost any component, including QFP, BGA, hybrid, assemblies, sockets, pins, connectors, LEDs, switches, buttons, transformers and more.
Each QWIKTRAY is CNC machined to the specific configuration for your component and ships ready to load and install in the equipment. Each QWIKTRAY includes CAD drawings, containing pocket dimensions, first part location, spacing, and other programing details. QWIKTRAYs come standard in non-ESD black acrylic (ESD-safe and other materials are optional).
CyberOptics – BOOTH #2721
Representatives will showcase CyberOptics’ new SQ3000 3D Automated Optical Inspection (AOI) system.
The SQ3000 3D AOI system maximizes ROI and line utilization with multi-view 3D sensors that capture and transmit data simultaneously, and in parallel, accelerating 3D inspection speed versus alternate technology. The proprietary Multi-Reflection Suppression (MRS) technology combined with the highly sophisticated 3D fusing algorithms offers microscopic image quality at production speeds. An easy-to-use, intuitive interface with touch control facilitates minimal training and operator interaction.
CyberOptics has already won three industry awards for the SQ3000 since its introduction in 2015.
Data I/O – BOOTH #1635
Data I/O will showcase the new LumenX programming technology integrated into the PSV7000 for the latest generation of eMMC devices and large file sizes. The LumenX programmer delivers the highest performance managed and secured programming for the lowest total cost per part. The LumenX programming platform is available in the award winning PSV7000 automated system and manual configurations.
With ultra-fast performance, the LumenX programming platform delivers programming speeds up to 80 MBytes/second and download speeds of 25 MBytes/second up to 5x faster than today’s programming and duplicating technology.
Data I/O will also showcase the new PSV5000 automated programming system at Productronica. The PSV5000 automated programming system is the cost effective entry point for high quality Data I/O programming. The PSV5000 delivers trusted performance, flexibility and reliability at an affordable price.
ERSA – BOOTH #1326
Ersa will introduce its new line of selective solder, reflow and rework equipment and more.
The VERSAFLOW 4/55 inline selective soldering system, offers a full range of new features: the new, intuitively operable, award- winning user interface ERSASOFT 5.0, motorized adjustable Y-axis for fluxer- and solder module, Y- and Z-variability, full convection preheater and a 508 x 508 mm usable process area for inline production. Through the perfect interaction of all system components, the process flexibility is once more increased and the productivity is further optimized.
The Ersa stencil printer VERSAPRINT S1-3D combines precise stencil printing and 100 percent 3D-SPI in one system – featuring the smallest footprint. The VERSAPRINT stencil printers with integrated 100 percent post-print inspection now include the new VERSAPRINT 3D-SPI – with even more process control and still minimal floor space requirements.
ERSA’s ROBOPLACE rings in a new era in man – machine collaboration during the soldering process. With its flexible dual-arms technology it frees up the operator to turn to more demanding tasks. While it does not replace the operators, it rather permits their transfer to perform higher-valued tasks. The lean-concept in combination with the SMART-factory is implemented, and a link to Factory 4.0 (Industry 4.0) is prepared.
The Ersa Hybrid Rework System HR 600/2 forms the base for the VOIDLESS Rework System. In modern electronic manufacturing, components with solder pads located on the underside of the component body are often used.
With the Ersa Hotflow 3/20 VOIDLESS, Ersa presents a process efficient solution to minimize the occurrence of voids, which is characterized by its high throughput in inline operation, short process times and low operating costs.
Essemtec – BOOTH #962
Essemtec will display technical innovations in 3D assembly and jet printing with live demonstrations.
High integration density demands electro-mechanical assembly in 3D. Essemtec will showcase a machine with the ability to stack components and subassemblies and join them with jetted solder paste or glue. This platform combines multiple process sequences to create complex micro devices, MEMS sensors, microwave assemblies and over- moulded lead frame components.
Essemtec has also designed a work cell comprised of a pick-and-place machine with integrated jet printing capability, a reflow oven and the Cubus SMT storage tower. Accurate inventory numbers and cost savings are achieved with seamless networked data integration. With this modest investment companies have the ability to rapidly test out new designs and produce small batches efficiently.
EVS International – BOOTH #1141
The simple but ruggedly designed EVS 500LF is highly ISO14001 compatible as it complies with the ISO mantra of reduce – reuse – recycle, enabling the customer to reduce solder consumption by up to 50+ percent. The EVS 500 also can help to reduce dedrossing time by 75 percent and waste dross off-site by up to 85 percent. The system meshes perfectly with environmental control systems and also helps to reduce customers’ carbon footprint, an important environmental imperative, by utilizing the latent heat already imputed to the dross to help the recovery process.
The EVS 500LF is connected to each wave to ensure that maximum recovery is maintained throughout the life of the wave solder system. Users can quickly recover up to 80 percent of pure solder with a higher ROI from the waste dross.
The EVS 8KLF offers a capacity of 6kg/12lbs. Its integrated hopper makes rapid transfer of dross simpler and safer, and speeds de-drossing times by up to 75 percent.
Fancort Industries – BOOTH #3010
Fancort will display its new line of SMT products, including the new FD Series Desktop Robotic Dispensing, inline and floor mounted depanelers and laser marking from Getech, the JAPAN UNIX SOLDER MEISTER Desktop Soldering Robot DF Series and its new Magnetic Universal Fixture.
FD Series Desktop Robotic Dispensing (Models: FD300V, FD400V, & FD500V). Standard accessories include a pneumatic controller, teach pendant, syringe and mounting bracket. The FD Series offers working areas ranging from 200X200mm for the FD200V, 300X320mm for the FD300V, and 400X400mm for the FD400V.
The Getech GBR Bottom Router is an inline machine specially designed to route (depanelize) printed circuit board assemblies (PCBAs) without the need for PCB fixtures.
The Getech GLMS Inline Laser Marking machine is specifically designed to laser mark PCBs with high positional accuracy and repeatability. With an integrated internal FLIP station, the GLMS can mark both sides of a PCB without it having to leave the machine. It is capable of handling large format heavy PCBs, ultra-thin and flexible PCBAs. The system is designed for marking formats ranging from 1D barcodes, 2D Matrix, QR codes and human readable characters as well as image formats.
The JAPAN UNIX SOLDER MEISTER Desktop Soldering Robot DF Series offers enhanced network functionalities for Industry 4.0. This includes the ability to connect to internal networks in factories and monitor production status. It features simple operation and improvements to the teaching robot with program changes in less than ten minutes. Up to 999 different soldering tips and product types can be programmed, reducing operation time for changing soldering points. The DF Series also features 3D soldering and two extra axes, for a total of up to 6 axes that can be simultaneously manipulated. Complicated products components and circuit boards are solderable without additional functions
FS Inspection – BOOTH #1445
FS Inspection will demonstrate their latest development – the VERSAMag High-Definition Inspection System. Each system is ergonomically designed with state-of-the-art technology to provide a complete line of advanced, accurate and affordable inspection products.
Features of the VERSAMag High-Definition Inspection System include:
• Flexible HD camera with multi-axis positioning and adjustable Z-heights for components of various shapes and sizes
• Real-time HD video inspection
• Intuitive controls that are quick and easy-to-learn
• Auto-focus enables continuous inspection, without the hassle of readjusting settings for each different component
• Accurate measurement capabilities and advanced image processing for detailed documentation and reporting with FS Inspection’s easy to-use software
Innovaxe – BOOTH #2322
The InoAuto SMART Mix part cart stores 480 of 8 mm equivalent 7″ reels and 160 of 8mm equivalent 13″ reels. It also contains a 42″ by 15″ SMART Tray to store printed circuit boards, waffle trays, and or bulk materials. One platform can accommodate multiple part sizes.
Inovaxe will showcase its SMART InoAuto Storage Systems. The InoAuto Two Bay stores 1,120 7″ SMT reels and the InoAuto Single Bay stores 560 7″ SMT reels. All of the SMART systems are equipped with sensors and LED indicator lights, along with the InoAuto Locator software, and respond as if the reels have RFID on them. The operator will simply barcode scan the part number and quantity on a reel and place it into an empty Single Package Single Location slot. The InoAuto will report the position of the part to its database automatically.
The InoAuto Smart ultra-lean material handling systems will allow you to find a part in less than four seconds and return a part in less than eight seconds. The InoAuto Smart system will reduce material handling time by more than 70 percent, reduce reel storage space by 60 percent, reduce travel time by 60 percent, increase inventory accuracy and operator efficiency. The carts are mobile, store 560 reels in 0.23 square meters or store 1120 reels in 0.42 square meters, and the ROI is less than six months.
Japan UNIX – BOOTH #3010
Solder Meister High Performance Soldering Robot: UNIX-410 Series. The premium model that achieves fast, precise, and high-quality soldering operation offers two slim types of high performance soldering robots. Both come with a clean cut feeder and lock-on mechanism, which are the most popular automatic options for precise work. The model offers durability and repeatability for cellular manufacturing. Additionally, UNIX-410S features “Kaizen” and “Poka Yoke” functions to maintain output quality and production speed. This high performance soldering robot improves cycle times by more than 15 percent.
Laser soldering robot. The technology makes automation possible where it previously not have been practical. Technology is evolving quickly with the emergence of ultra-fine electronic circuit boards and multi-layered electrical components. Laser soldering makes it possible to solder ultra-fine areas and others that are difficult to reach using tip soldering.
Ultrasonic Soldering: No need for flux. Ultrasonic soldering is mainly used for “flux-less soldering” or “flux-free” to non-metals such as glass, ceramic, and difficult-to-solder metals such as aluminum and stainless steel. Environmental concerns have been seen in global societies and manufacturing industries as represented by RoHS and other regulations. Ultrasonic soldering helps manufacturers to reduce or eliminate the use of halogen material, which is the main chemical in flux.
JUKI – BOOTH #763
Juki will display a high-mix line along with several updated flexible solutions designed for both high-volume and high mix environments, including: The high-mix line will feature the GL Fully Automatic Screen Printer, KE3010 and KE3020 Flexible Mounters, and RS-600II Six Zone Reflow Oven. The JM-20 Hybrid (Through-Hole) machine also will be on display.
Designed for the optimal management of larger dimension reels, the ISM2000 Fortress offers the flexibility to support a combination of 7″ reels from 8-16 mm in height, 13″/15″ reels up to 44 mm in height as well as JEDEC trays. The ISM2000 uses a patented multiple outlet system that allows for the simultaneous extraction and insertion of up to 27 reels at a time. The outlet system also supports the extraction of a single reel in quick fashion.
The ISM UltraFlex 3600 builds on the strengths of its ACS/ISM 2000 predecessor, with even higher speed/throughput, powerful software and an intuitive interface, now fully on touchscreen devices. The new machine and case designs enable the UltraFlex 3600 to store a maximum number of 3600 7″-8 mm reels, but can accept any mix of reel sizes. During idle time, the machine will automatically sort cases to optimize the distribution of reels of different formats, always providing the maximum possible storage capacity.
The CUBE.460 selective solder system sets the new standard for dual nozzle mini-wave soldering systems. The unique CUBE.460 batch platform offers excellent flexibility for through-hole applications. The CUBE.460 can be configured with a single nozzle or dual nozzle for increased flexibility. The system comes equipped with many standard features that include heated nitrogen at the soldering nozzle, 0° and 7° soldering to accommodate various types of nozzles and an exchangeable pot system to support both leaded/unleaded alloys.
The RX-6/RX-7 Flexible Placement Machines are now available in a 6×6 version (six heads front/rear) for high-speed and the 6×3 version (high-speed front/flexible rear). All machines include both standard and high resolution front/rear cameras for added speed, accuracy and flexibility. The RX-6 also includes two feeder trolleys – additional are optional. The system supports the new smaller TR8 Matrix Tray Changer that takes up less feeder space while allowing for maximum capacity.
JTAG Technologies – BOOTH #2413
JTAG Technologies’ will display the following highlights from their comprehensive ATE product portfolio:
• ICT, MDA or flying probe systems are quickly and easily upgraded with JTAG Technologies’ boundary-scan solutions. Special add-on cards and software integration suites enable users to benefit from the features of the combined systems.
• Traditional functional tests based on National Instruments’ LabView/TestStand, C++, .net and other programming languages often feature complex and time-consuming test programs. Easy access to your assembly via boundary-scan pins can simplify your existing test programs and ease diagnosis in case of faults.
JTAG Technologies is also showcasing the latest in its highly regarded range of boundary-scan controller hardware for PCB assembly and system testing– the versatile JT 5705 series.
• The first in the series – JT 5705/USB – is supplied as desk-top instrument, primarily aimed at hardware validation applications in design, small-scale production test and in some cases field service and repair. The JT 5705/USB features two 15 MHz TAPs and 64 I/O’s available through 0.1” IDC connectors. 56 of the I/O channels are always digital, 16 of which also feature a frequency function. The remaining 8 channels can be used as either digital I/O or analog I/O. The unit also contains a user programmable FPGA facilitating application specific digital I/O options.
• The second model in this new range is the larger JT 5705/RMI, a 1U high 19” rack-mountable instrument for use in systems or as a bench-top tester. This unit features four 15 MHz TAPs and 4 groups of 64 mixed-signal I/O channels providing a total of 256 I/O’s available through 0.1” IDC connectors. As before, within each 64 channels group, 56 channels are permanently digital with 16 available as frequency inputs. The other 8 channels of each group can be individually programmed as digital I/O or analog I/O channel.
KIC – BOOTH #2628
KIC will demonstrate how its smart oven technologies lead to reduced production cost, higher quality and new capabilities that the electronic assembly market is starting to demand.
Looking forward, the majority of additional customer value will be created in the utilization of the ovens, and that is the area where KIC has and continues to develop new technologies. KIC’s technology provides either near instant oven changeover time or dramatically reduced downtime. Additionally, KIC’s automatic systems eliminate manual tasks such as periodic manual profiling and reduce the opportunities for human mistakes in setting up and running the ovens.
METCAL – BOOTH #3412
Company representatives will show the Metcal USF-1000 Solder Wire Feed System for the first time, along with Metcal’s proven rework and repair equipment, including the Scarab Site Cleaning System, Scorpion Rework System, MX-5200 Soldering System and more. The new Metcal USF-1000 Solder Wire Feed System adds a new level of control and convenience to the soldering process.
The Scarab Site Cleaning System ensures accurate and repeatable cleaning of the component pad in one user-friendly system. Additionally, the Scarab addresses the industry needs with an automated system capable of cleaning component pads without contact. The system allows the user to add site cleaning capability to their operation without the investment of replacing their current component rework system.
The Scorpion redefines precision and addresses the technical demands presented by component manufacturers today. Metcal’s Automatic Placement Package is capable of 50mm of motorized travel in the Z-axis and a full 360° in θ (Theta). The Automatic Placement Package offers fine motor control in the Z-axis and θ during alignment of the component to the pad. The new force feedback control during the placement process enables the unit to accurately pick and place components without disturbing the component or solder.
The MX-5200 features a dual-simultaneous use option, meaning that two hand-pieces can work from one power supply at the same time. The dynamic option enables the two hand-pieces to share 80 watts output power based on demand, adding even more application flexibility and speed. Four different hand-pieces and a comprehensive range of soldering and rework cartridges support the MX-5200 Series simultaneous dual operation. These include the Metcal Advanced™ Hand-Piece for SMD rework, a Metcal Ultra-Fine™ Hand-Piece for fine access, a Precision Tweezer capable of removing a range of components from 0201 chips to 28mm SOICs, and a Desoldering Gun for safely removing through-hole components.
MIRTEC – BOOTH #1334
MIRTEC will feature a total of seven (7) inspection systems. The award-winning MV-6 OMNI 3D AOI Machine is configured with MIRTEC’s exclusive OMNI-VISION 3D Inspection Technology which combines our 15 Mega Pixel CoaXPress Camera Technology with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system in a newly designed cost effective platform.
MIRTEC’s MS-11E 3D SPI Machine is configured with MIRTEC’s exclusive 15MP CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. The machine uses Dual Projection Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste depositions on PCBs post screen print for insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. MIRTEC will have two (2) MS-11e’s on display one configured with a 10um lens for High-Performance applications and the other with a 15um lens for High-Speed applications.
MIRTEC’s MV-7 OMNI-QHD 3D AOI Machine features the next generation of MIRTEC’s award-winning OMNI-VISION 3D Inspection Technology in a High-Performance AC Servo Drive Platform. This revolutionary technology combines our proprietary 15MP CoaXPress Vision System with MIRTEC’s exclusive Quantum High Definition (2048×1536) Digital Multi-Frequency 3D Projection Technology to provide unprecedented image quality, accuracy and repeatability necessary for precision inspection of SMT devices on finished PCB assemblies. The MV-7 OMNI-QHD machine also features four (4) 10 Mega Pixel Side-View Cameras for inspection of Regions of Interest which are not accessible with the 15 MP Top-Down Camera.
The company will also showcase the MV-6E In-Line AOI Machine configured with MIRTEC’s exclusive INTELLI-SCAN 3D Laser System, the MV-3L Desktop AOI Machine featuring the INTELLI-BEAM 3D Laser System. MIRTEC’s total quality management system software, INTELLISYS will also be on display.
Nihon Superior – BOOTH #2610
Nihon Superior will exhibit two innovative new alloys. SN100CVTM P506 D4 is a lead-free, no-clean solder paste with its basic composition of (Sn-Cu-Ni+Ge+Bi). This new alloy has an addition that enables thermally stable solder joints even after thermal cycling. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The unique ability of SN100CV P506 D4 to survive long-term storage at room temperature allows simplification of stock management while meeting all the requirements of modern reflow soldering processes. The SN100CV alloy is also available as a completely halogen-free solder paste, SN100CV P604 D4 and a low residue paste, SN100CV P820-5 D4.
Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effectively join most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces make it possible to achieve strong bonds even on copper with high electrical and thermal conductivity at low temperatures without the need for external pressure.
Pillarhouse – BOOTH #
Pillarhouse are introducing the desktop entry level Pilot machine to the US market. Perfect for small to medium batch hand-load operations wanting a high specification value option and ideal for SME producers where floor space is at a premium and flexibility and energy saving are key considerations. The Pilot is designed to process boards up to 330mm x 250mm.
The Pilot is controlled by our acclaimed PillarCOMM industry leading programming and control software, giving the operator the ability to create any process programme quickly and easily using our proven ‘Point & Click’ interface.
Pillarhouse’s patented, industry leading Drop-Jet fluxer is fitted as standard. An optional bottom side IR pre-heat is available, for users processing multi-layer PCB’s or using water based fluxes.
Scienscope International – BOOTH #1032
Scienscope will launch their new AXI5100c X-ray Component Counter for the first time and showcase some of its flagship AXI products: X-SCOPE 1800, X-SCOPE 6000 and AXI-8000.
The AXI5100c is a new innovation in counting components, capable of counting the latest 03015s as well as (4) 7″ or (1) 15″ reels of various thicknesses. Beyond counting reels, the AXI5100c can also count components in ESD bags, storage sticks, and trays.
The AXI5100c also can perform traditional X-ray inspection of electronics and counterfeit component detection. The AXI5100c -i is a fully automated inline system that can handle loading and unloading of components using various conveyors, loaders/unloaders and even robots.
The X-SCOPE 1800 Cabinet X-ray Inspection System is a full-featured entry level system, featuring a state-of-the-art 90 kV micro-focus X-ray tube and a standard 4′ x 3′ digital flat panel detector with tilting capability.
The X-SCOPE 6000 is a more advanced system, including a 130Kv micro-focus X-ray tube with optional 5″ x 5″ digital flat panel detector or optional ultra-resolution digital flat panel detector. Both have tilting capability up to 65°. The X-SCOPE 6000 also has a rotating table that can move a total of 350° (+/- 175°).
The AXI-8000 is a fully automated inline X-ray machine that can either inspect with traditional 2D or an advanced Planar CT for reconstruction of 3D images. There is no movement of the sample once it is in place. After reconstruction, each slice can be viewed, giving greater detail of each layer in comparison to traditional 2D with overlaying images.
Specialty Coating Systems (SCS) – BOOTH #2925
The SCS Precisioncoat V’s conformal coating and dispense valves move smoothly along the three axis system, with an option to add fully programmable fourth and fifth axes for tilt and rotation capabilities. The system’s multi-valve technology allows for the application of dots, lines, fills, glob tops and spray coat areas.
The SCS Ionograph BT Series is available in small, medium or large sizes to accommodate customer board requirements. The ionic contamination test systems offer the same convenience, accuracy and reliability as their predecessors, but have been modified to enhance safety and ease of maintenance.
SCS also will exhibit ultra-thin, pinhole-free Parylene conformal coatings, which offer superior moisture, chemical and dielectric barrier protection to a host of components, including circuit boards and assemblies, sensors, MEMS, LEDs and wafers, to name a few. SCS is the leader in Parylene coating services and technologies with eleven coating facilities around the world, including six in the Americas, three in Europe and two in Asia.
SEHO – BOOTH #1850
SEHO continues to release new technologies. The SelectLine-C machine concept is completely modular, thus ensuring clear cost benefits. The fluxer module, various preheat modules and soldering modules may be equipped individually, and depending on the requirements, they can be configured into a complete manufacturing line.
The soldering area of the SelectLine-C has two electro-magnetic soldering units for mini-wave or dip processes may be integrated. Two unique, new features that are patented by SEHO ensure a remarkable increase in productivity: The automatic ultrasonic nozzle cleaning function guarantees reliable processes and maximum machine availability, and the Synchro software feature nearly doubles production volume without a major investment.
GoSelective-LS is particularly designed for stand-alone production of small and medium sized volumes and occupies a small footprint. To ensure an ergonomical work flow and the shortest cycle times, the GoSelective-LS is equipped with a loading and unloading station for carriers up to 20” x 20” that is mounted in front of the machine. This station incorporates a manually moved cross transfer that allows users to comfortably slide the carriers from left to right and vice versa. Therefore, it is possible to assemble boards in one carrier while a second carrier is being processed in the machine.
Seika – BOOTH #1145
The Seika team will be available to demonstrate industry-leading equipment from Sayaka, Hioki, SAWA, McDry, Eightech, Unitech, Andes, MALCOM and DENON INSTRUMENTS.
The RD-500V Rework Station features a two mega pixel full HD camera with a 19″ LCD display for easy visual alignment. It samples the data in very small intervals of 0.1 sec, allowing extremely accurate temperature control. The RD-500V is equipped with powerful built-in 1000W heaters on both the top- and bottom-side, and an area heater that includes six quick heating 600W IR heaters. Precise profiling including detailed temperature curves can be executed with the ability to closely control up to 30 zones.
The UC-250M-CV Board Cleaner adds a dual cleaning feature using a combination of a brush roller with the silicone/adhesive cleaning rollers. The combination dual dust removal system assures better results than a single brush or adhesive roller system.
The SAYAKA SAM-CT35Q Large Board Model is a tabletop, automatic precision PCB router. The compact size and weight of the system makes it ideal for limited work spaces and versatility in a production line setup.
The MALCOM PCU-200 Digital Viscometer features a patented spiral-pump sensor that provides quick, easy and repeatable measurements. It provides continuous measurement of newtonian and non-newtonian fluids with constant shear rate and shear time.
Smart Sonic – BOOTH #2304
With the strong dollar impacting international sales, Smart Sonic has invested time and resources into lowering the cost of the next generation stencil cleaners. The New Model 6100 comes fully loaded with the most popular options and CE certification yet the selling price is almost 20% less than its predecessor!
The Model 6100 is the “workhorse” of the Smart Sonic line of ultrasonic stencil & pallet cleaners. Able to clean 29” x 29” stencils in less than 2 minutes, the Model 6100 can also clean wave solder pallets, oven radiators, misprinted PCBs and associated tooling used in the SMT printing process.
Like all Smart Sonic Stencil & Pallet Cleaners, the Model 6100 is compatible with Smart Sonic’s exclusive EnviroGuard 100% Closed-loop Technology and 440-R SMT Detergent, the only VOC-free stencil cleaning chemistry.
Sono-Tek -BOOTH #1141
Beginning in 2016, Sono-Tek will be incorporating its latest ECHO ultrasonic generator technology in all new SonoFlux spray fluxing systems, including the SonoFlux Servo, SonoFlux EZ and SonoFlux 2000F systems, resulting in process improvements. ECHO enables very fast swap out of any nozzle without changing any settings, making maintenance and replacement of nozzles a breeze. In addition, the ECHO is more than twice as energy efficient as its predecessor, and is certified CE and RoHS compliant.
As part of the power system upgrade, a new M8 cable connection offers further improvement in enhanced power delivery to the ultrasonic nozzle. This robust cable features superior connection with greater
corrosion resistance, higher electrical protection (IP67) and better reliability.
TRI – BOOTH #1134
Test Research, Inc. (TRI) will feature a new generation of SPI, AOI, AXI and ICT inspection solutions. The 2016 portfolio includes new mid-range TR7700QI stop-and-go 3D AOI system 3D solder fillet inspection designed for high-mix productions including mobile and PC applications. Also launching in 2016 are high accuracy stop-and-go 3D SPI TR7007QI and all new TR5001 SII INLINE Multi-Core Parallel ICT. The complete inspection lineup includes CT-capable 3D AXI system TR7600 SII CT and TRI’s acclaimed TR5001T SII TINY ICT solution for standalone deployment with parallel testing.
Discover how TRI’s PCBA test and inspection solutions work together with Industry 4.0 data based YMS 4.0 management infrastructure to bring you maximum value in the production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRI’s systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load.
Viscom – BOOTH #1763
For the first time in North America Viscom will unveil the new and completely redesigned version of its most successful and well established X7056 in-line automatic X-ray inspection system. Now equipped with powerful digital flat panel detectors and X/Y stages, the new X7056 FPD allows for even more accurate planar 3D analysis of hidden fine-pitch solder joints such as μBGA, QFNs and stacked packages (PoP), achieving an immense improvement in X-ray image quality.
Additionally, the X7056 combo system is now optionally equipped with Viscom’s new high-speed 3D XM camera module with high resolution top-down and up to eight angular views. Fast shadow-free 3D automatic optical inspection (AOI) and simultaneous 3D automatic X-ray inspection (AXI) enable operators to reliably detect 100 percent of visible and hidden solder defects with highest flexibility at maximum throughput.
VJ Electronix – BOOTH #1834
The company will demonstrate the improved Micra system, XQuik II with AccuCount Technology, Summit II and Vertex II.
The popular Micra is designed for rework of smaller, high performance components, such as Chip Scale Packages (CSP), Package on Package (PoP) and Micro Passives (01005). The enhanced Micra provides a larger 35 mm alignment field of view, expanding its range of applications into more automotive, medical and military/aerospace products.
The revolutionary XQuik II with AccuCount Technology is helping manufacturers around the world keep accurate inventory of their component reels. The XQuik system automatically counts components as small as 01005 with better than 99 percent accuracy. The process takes only seconds, and requires no programming. The new XQuik II handles reels from 7 to 15″.
The new Summit II is the latest semi-automated rework system. Improved ergonomics combined with next-generation controls and proven heating technology provide the greatest performance and flexability. Summit II features a smaller footprint, yet larger board capacity with easy to adjust board support fixtures. Enhanced SierraMate software takes the popular user-friendly operation to the next level with a simple icon driven GUI and unmatched flexibility through easily customized operation sequences.
The Vertex II incorporates the latest advances in X-ray imaging components with off-axis viewing, all in a smaller footprint. The system offers VJ’s proven production readiness, superior uptime and unmatched value. The Vertex II, now CT ready, is equipped with a standard high contrast, high resolution CMOS digital detector, can be configured with a variety of X-ray sources and optional detectors to meet specific application needs.
YINCAE Advanced Materials – BOOTH #1718
On Thursday, March 17th, 2016 from 9:00a.m. – 10:00a.m., Dr. Yin will be presenting his white paper, “Can Lower Temperature Solderable Adhesive Replace SAC Paste?” He will not only discuss the development of low temperature solderable adhesives to replace SAC applications, but the myriad of benefits for use across industry domains. The low temperature solderable adhesives can be used anywhere, particularly for wafer-level (CSP), package-level, and board-level (LGA, BGA, and QFN) to name a few. The reliability was equal or better than that of SAC alloy. The low temperature solderable adhesive has improved drop performance by two magnitudes compared to Sn/Bi alloy.