Internepcon Japan 2016


Yamaha ZLEX.

The Big Sight in Tokyo once again hosted Internepcon Japan 2016. Without doubt this is the biggest electronics show in the world in terms of the sheer numbers of vistors. 2015 attracted an incredible 86,000 visitors and this year’s event brought in 83,557 visitors.

The show comprises a number of smaller show areas that make up the whole. These include; Wearable Expo, Electrotest Japan, Internepcon Japan, IC Packaging Technology Expo, PWB Expo, Electronic Components & Materials Expo, Fine Process Technology Expo, Light Tech Expo and International Lighting Fixture Expo, all taking place in the East Halls.

In the West halls the emphasis was on the burgeoning automotive industry with Car Elec Japan, EV Japan, Automotive Components Processing Technology Expo.

Entering the halls, the first product that caught my eye was a new printer from Minami. Minami is more commonly known among the semiconductor industry for producing wafer printers and ball placement systems, this is there first launch of a stencil printer for SMT Assembly. The Mark 888-SV has an 8 second cycle time, accuracy of ±0.015mm or less and a maximum board size of 750 x 650mm.

Minami Mark 888-SV.

Minami Mark 888-SV.

Yamaha IM maintained their aggressive growth plan with two new printer models; the YSM 20 has a placement speed of 90,000cph, a large board size and dual lane capability. The Sigma F8 is the latest improvement on the high-end mounter acquired from the merger with Hitachi. The Sigma F8 can place up to 150,000cph.

And finally, the Yamaha stable launched their first 3D AOI system. The predecessor to the YSiV already holds up to 90 percent market share, according to reports from the company.

The Yamaha sister company, i-Pulse also launched a range of three new mounters

Japan Unix displayed a new twin-beam laser for soldering rows of small components. They also demonstrated a customized laser robot, capable of soldering a 3D-MID component.

Yamaha Sigma.Yamaha Sigma.ESPEC launched a new environmental testing chamber with an integrated barcode system for improved traceability. The chamber is capable of texting assemblies from -40° C to +120° C.

SAKI claim they offer the most robust AOI inspection system, which is critical for accurate metrology readings for integrating with factory automation systems. The company has 13 direct sales and service offices globally, servicing over 76 countries, offering the same high level of support around the world.

FUJI showcased their “Smart Factory” solution called Nexim. The system comprise a set of tools to “Plan, See, Do” using a collection system to schedule creation, changeover support, and flexible data management.

Koh Young upgraded their SPI and AOI systems to make them capable of accurately inspecting 0201 (metric) with ±5μm accuracy. The company also introduced an AOI system with an additional projector for measuring coplanarity and the “z” height up to 25mm.

Yamaha YSIV.

Yamaha YSIV.

ASM Assembly Systems made their debut in Japan with their new e by Siplace brand, comprising a mid-speed pick and place machine and the ICON range of printers. Unlike the high volume machines from SiPlace and DEK, the e by SiPlace range will be marketed and supported through a global distribution network.

Tokyo Weld manufactures component inspection systems. Each component is inspected by an array of 6 cameras for micro-cracks and other defects before they are packaged into tapes and reels.

Nihon Superior introduced a suite of four new alloys and pastes. SN100C P506 D4 has a nickel germanium composition which makes it ideal for PCB plating using HASL. SN100CV is a Sn, Cu, Ni, Ge, Bi formulation that provides a harder solder joint as the Bismuthinfuses into the tin matrix.

Another new product from the Nihon stable is Aconqno, a silver paste thermal interface material that is applied using the sintering process for void-free bonding.

6Alusac 35 is an alloy for soldering to aluminum wire, which is increasingly being used in automotive applications to reduce weight.

Internepcon Japan is scheduled to be held on January 18 – 20, 2017 and already the show floor is looking mostly sold. Next year’s event is expecting a 25% boost in numbers as an advanced robotics show is added to the list of shows that make up the event. With the current trends in factory automation, this will be a welcome addition and will enable manufacturers to view complete electronics automation solutions under one roof!



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