New Products – July 2017


Ionic contamination test for quantitative analysis

The ionic contamination test, also known as ROSE Test (Resistivity of Solvent Extract), is an extractive analysis technique offered in ZESTRON’s Analytical Center, enabling the quantitative measurement of ionic contamination on an electronic board according to IPC-TM 650 2.3.25. Thus, initial risk evaluations conducted at an early stage can identify potential problems that may lead to future field failures. For a more precise analysis, ion chromatography is available which provides both quantitative and qualitative ionic contamination measurements.

■ DELO adhesive for electronic applications.

DELO Industrial Adhesives has the allrounder for seal-bonding

DELO Industrial Adhesives has developed a light-curing acrylate with excellent peel resistance for seal-bonding. DELO PHOTOBOND GB4033 has features that make it suitable for universal use, for example, in electronic applications. Designed for service temperatures ranging from -40 °C to +120 °C, it is particularly suited for material joints that require adhesives not only to be strong but also flexible and tight. The product provides very good sealing properties against water, humidity, and dust, as is often required in the world of consumer electronics. In addition, an elongation at tear of 400 % allows it to equalize tensions to a large extent. This elasticity contributes to the good peel resistance on glass and plastic. Its average peel strength on PEEK, PC, or PET is 14 N/cm compared to 1-3 N/cm for standard acrylates. DELO PHOTOBOND GB4033 is fluorescent in blue, which is very useful for controlling precise application of the adhesive and for process control. The adhesive cures under both UV and visible light. This large wavelength coverage makes it possible to use transparent materials with low transmittance such as PC. The minimum curing time to reach final strength is four seconds at typical intensities of 200 mW/cm², enabling high-volume applications at short cycle times.

■ TopLine SOT Jumper component.

Low-cost SOT jumpers eliminate PCB re-design headaches

TopLine offers SOT Jumper components, a low-cost way to short out (JUMPER) Printed Circuit Board circuitry without the need to redesign or spin a whole new board. TopLine SOT23 components short-out specific pins together with less than 50 milli-ohms resistance. “SOT Jumpers are a quick and easy to replace unneeded circuits,” states Martin Hart, TopLine’s President. “Our SOT23 Jumpers mount on the PC Board using normal SAC305 lead free solder paste, just as regular components.” In the most common configuration, for example, Pin 1 is shorted to Pin 3; another configuration shorts Pin 2 to Pin 3. TopLine also makes a version with Pin 1, Pin 2 and Pin 3 all shorted together. TopLine’s series of SOT23 Jumpers withstand 75VDC at 100mA with 350mW power dissipation. Their operating temperature range from -65?C to +150?C.

■ ALPHA OM-347 solder paste material.

Alpha solder paste for ultra-fine feature printing & reflow 

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is introducing its newest solder paste innovation for ultra-fine feature printing and reflow applications. ALPHA OM-347 is an ultra-cleanable, no-clean, lead-free, zero-halogen solder paste material that can print and reflow Type 4 and Type 5 powder to meet market segments requiring ultra-fine feature applications. “ALPHA OM-347 is one of the first solder paste formulas introduced specifically designed as an ultra-cleanable, no-clean material”, said Traian Cucu, Global Product Manager for Solder Paste at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses. “It has an outstanding reflow process window that delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes”



■ eFPGAs enable programmability in SoCs for mobile and consumer products eFPGAs enable programmability in SoCs for mobile and consumer products.

Menta offer validation board for embedded FPGA

Menta SAS announced a validation board supporting TSMC’s 28-nanometer High Performance Compact Plus (28HPC+) process. The board includes a test chip with an embedded FPGA (eFPGA) IP core from Menta, and is supplied with all of the hardware and software required for validation of the complete eFPGA design flow from RTL to bitstream, and through final hardware test and measurement. Menta’s eFPGAs enable programmability to be embedded into complex SoCs, allowing changes to be made to the RTL at will, post-production, thereby eliminating costly re-spins. This capability is critical to meeting the sometimes conflicting requirements of changing standards, security updates and shrinking time-to-market windows of mobile and consumer products, IoT devices, networking and automotive ICs.




■ PDR IR-TS One IR Thermal Test System

Micro-focused IR thermal testing with PDR’s focused IR

PDR introduces the benchtop based PDR IR-TS One IR Thermal Test System, designed to thermally cycle key critical components and assemblies to detect defects. Using PDR’s unique Non-Destructive Dual Thermal Stress Screening Process, based on a variation on HALT/HASS principles, the system is able to focus the testing on suspected problem areas to safely screen out early field failures caused by design, environmental, production and structural defects. It is not always convenient to use an environmental test chamber for controlled thermal testing of just a confined area, such as a single component. It would be useful to be able to heat a component and PCB individually to different temperatures in a non-contact way without the use of chambers, nozzles, interchangeable heads or special tooling and on the benchtop. The PDR IR-TS One uses PDR’s unique dual zone IR heating and gas cooling process that independently heats the PCB and component in a safe thermal cycle and can be used during live system/function HALT/HASS testing. Applications are vast but include, component characterization testing, bare die testing, component and PCBA design validation testing, solder joint validation, polymer bond testing. Industries include automotive, aerospace, defense, medical and consumer electronics.

■ Electrolube’s Safewash Super (SWAS), an innovative cleaning solution .

Electrolube produce complete cleaning solution

Electrolube, has developed an innovative cleaning solution called Safewash Super (SWAS) for PCB wafer assemblers, following close collaboration with a number of manufacturers to considerably improve their cleaning capabilities as well as speed up throughput, reduce costs and decrease environmental impact. Whilst cleaning processes can vary from plant to plant, the silicone wafer manufacturers in collaboration with Electrolube all had many issues in common. These included experiencing a bottleneck in production due to a slow cleaning process, using a solvent based cleaning product – which produced disappointing cleaning outcomes as well as increased rejects and re-work – and concerns with environmental impact with regard to storage, transport, disposal and employee safety. The existing solvent-based products in use also displayed a relatively low contamination ‘load bearing’ capability, which resulted in a more frequent need to replace material for a fresh batch.

Flying Test Systems increases Test Coverage with XJTAG

XJTAG, a supplier of boundary scan technology and Flying Test Systems, a provider of electronic test solutions in the UK and Ireland, announce the signing of a joint Technology Partner Agreement. Flying Test Systems offer electronic circuit board test and repair services, Design for Test (DFT) consultancy services along with in-circuit, SPEA flying probe and bespoke functional test equipment for production. Commenting on the agreement with XJTAG, Nigel Priest, Managing Director, Flying Test Systems, says: “Test engineers face increasing pressure with devices that have little or no access to their pins, and space for test points is under pressure. At Flying Test Systems we are constantly looking out for the best test solutions for our clients and found that XJTAG boundary scan offers great functionality that is priced competitively, user-friendly and comes with a flexible licensing model.” XJTAG has been working with a variety of test solution providers including flying probe vendors in order to offer the best-in-class test capability and value for clients.

View the full article in Global SMT & Packaging July issue.


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