New Products – November 2016


■ Comau’s new Racer5 robot.

Two new robots for Comau: Racer5 -0.63 and Racer5-0.80

The small robot family is growing based on the existing Racer3 technological platform Comau presents the extension of its small robot family for quick applications in restricted spaces, including handling, assembly and pick&place, by introducing two new robots – Racer5-0.63 and Racer5-0.80. Both are controlled by the R1C 19″ rack-mounted controller, which can be integrated into a single cabinet to control an entire line. The robots are also available in the openROBOTICS version where the robot is directly integrated into the existing machine/line automation controlled by B&R technologies.

New adhesives with special flow properties for die coating

DELO has developed new glob top adhesives featuring optimized flow properties. They allow chips, for example in MEMS sensors, to be coated in a uniform thickness of less than 100 μm that does not extend beyond the chip edges. Increasing miniaturization in microelectronic packaging gives rise to new demands on the glob top materials used. For example, manufacturers of mobile phones are now demanding a maximum thickness of 0.6 mm for MEMS packages. That means that the die coating materials used to protect the chip upper side have to be as flat as possible. The use of DELO heat-curing acrylates yields convincing results, especially when a uniform and reliable coating that does not flow beyond the chip edges is to be applied to the upper side of chips.

■ Engineered Material Systems’ 35-11M-12 UV cured epoxy.

■ Engineered Material Systems’ 35-11M-12 UV cured epoxy.

Engineered Material Systems’ new UV cure adhesive

Engineered Material Systems debuted its 535-11M-12 UV cured epoxy formulated for disk drive, camera module, optoelectronic and circuit assembly applications. The epoxy has been designed to pass rigorous reliability requirements.ecm-dam-fill-encapsulants

535-11M-12 is a screen printable version of the 535-11M-7 UV cure adhesive. The material is designed to eliminate any warpage in electronic assemblies and can be used in other bonding applications in fiber optics and camera modules. The material also can be used for lens bonding, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

This new non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-11M-12 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony.

PDR Americas’ intra-ocular-adjustable thermal sensor

PDR Americas, a leader in IR rework, test and inspection, introduced the EMS industry’s first intra-ocular-adjustable ‘read zone’ thermal sensor for high-end rework. The rework-specific temperature sensor has been specifically engineered for rework environments, providing the accuracy and confidence needed for high-yield rework program success.

This upgraded version of PDR’s Analog Z-Class sensors is now available with embedded digital technology designed for 10th order polynomial resolution to provide the most accurate sensing technology in its class. Accurate to within +- 1 percent at 250°C, PDR’s latest rework sensor also provides precise intra-ocular LED targeting of the area to be measured, thus eliminating independent laser finders that require merging the detector, the laser, and distance to target.

Made in the U.S.A. and specifically designed for rework applications, PDR’s Z+ Class thermal sensors are focusable to measure single point surface area targets within a diameter range of to 1mm-12mm without having to account for distance to target calculations. This versatility offers accurate in-process control for densely populated PCB rework tasks involving very small packages in addition to QFNs, QFPs, microBGAs, connectors and high sphere count super BGAs.


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