New Products: September 2017

■ Dow Corning EA-5151 adhesive.

Ellsworth Adhesives’ new Dow Corning EA-5151 adhesive

Ellsworth Adhesives Europe is delighted to announce the addition of the new Dow Corning EA-5151 adhesive to its product portfolio. This ‘Quick in Connect’ (QiC) adhesive has been formulated to accelerate electronic assembly and increase production throughput. Available as a one-part silicone formulation, Dow Corning EA-5151 is applied as a warmed liquid with a plunger-equipped gun or a robotic dispenser. It cools to a solid viscoelastic material, ensuring primerless adhesion to a broad range of metals and plastics, including substrates that are difficult for many alternative solutions to adhere to. A neutral cure RTV adhesive, EA-5151 has been aligned with transportation electronics market trends to offer a key solution to support vehicle efficiency improvement with overall increased safety, enhanced comfort and entertainment.

■ ALPHA AccuFlux Technology.

Alpha’s product Innovations target voiding Issues

Alpha Assembly Solutions addresses the issue of voiding with its latest selection of advanced product technologies. Voiding is a common issue in PCB Assembly and is caused by volatile ingredients in the solder paste. Voiding can occur anywhere in the solder joint and is especially problematic as it reduces the mechanical properties and thermal conductivity of solder joints. To solve this issue, Alpha has developed the revolutionary ALPHA AccuFlux Technology for preforms. The flux coating when applied to a preform is engineered to decrease voiding for power components that require consistent low-voiding solder joints from normal SMT processes. “ALPHA AccuFlux Technology allows a specially designed coating with an ultra-low voiding flux formulation to be applied accurately from preform to preform,” explains Mike Marczi, Vice President of Engineered Materials at Alpha Assembly Solutions.



Indium Corporation’s new solder paste for fine feature printing

Indium Corporation has released Indium11.8HF-SPR (T5-MC) Solder Paste – a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of mobile manufacturers. Indium11.8HF-SPR specifically addresses the move toward type 5 powder. This new solder paste delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance. Indium11.8HF-SPR benefits: Halogen-free per IEC 61249-2-21 test method EN14582 High-transfer efficiency through small apertures (≤ 0.66AR) Long stencil life (>12 hours) Eliminates hot and cold slump to inhibit bridging and solder beading defects Avoids the potential for HIP and graping defects with a unique oxidation barrier.

■ The new C12 High Definition Digital Microscope from INSPECTIS AB.

INSPECTIS AB launches the C12 digital microscope

Remarkably uncluttered, and thoroughly ergonomic, the new C12 High Definition Digital Microscope from INSPECTIS AB offers innovative new features and performance not found in competitive systems. The C12 is a plug & play, reliable and cost effective high definition camera microscope designed for the most challenging SMT/PCB electronics assembly and rework applications, an All-in-One optical digital inspection system with 12:1 optical zoom, auto focus, integrated illumination, on-board controls and SD-card image capture. The C12 produces crisp images of inspection objects up to 90x magnification directly on an LCD monitor or PC. IINSPECTIS C12 provides relief to eyes, neck and shoulders through the unique ergonomic design and 245mm working distance. By allowing operators to sit comfortably in a good working position, their inspection tasks can be carried out more efficiently.


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