New SMT Products – April 2018

New black epoxy underfiller

Panacol has developed a new epoxy-based underfiller. Structalit 8202 is a low viscosity one-part adhesive with a high capillary flow filling the narrowest gaps. Structalit 8202 is a high performance underfill material designed for chip stack packages and BGA. It is a one part, black colored epoxy with low viscosity which flows into the narrowest gaps. Special fea-tures of this product are its low coefficient of thermal expansion and high glass tran-sition temperature. This makes Structalit 8202 stable at high temperatures, allowing usage in reflow processes. Structalit 8202 cures rapidly under the influence of heat. The underfiller can also be cured during reflow processes.

Rehm Expert database covering all aspects of voids

Rehm is offering a database tool which provides an overview of influencing factors and interaction amongst the mechanisms which result in voids. The occurrence of voids is surely one of the most interesting phenomena associated with soft soldering. As a rule, larger or smaller voids can be found in most solder joints, which are formed as the result of gas which is trapped in the molten solder. When the molten solder hardens, these gas bubbles are frozen into place. The reliability of most solder joints is not necessarily influenced decisively by voids contained within them, although there are exceptions. For example, sensitivity to voids is taking on new dimensions with regard to evolving package trends such as LGAs and QFNs. The greater the power loss which has to be dissipated via a solder joint, the lower its tolerability to voids is. In particular solder joints in power semiconductor devices should be nearly void-free. This expert database makes a considerable contribution to understanding the mechanisms involved in the occurrence of voids and outgassing, and identifying the essential influencing variables. Influencing variables and the ways in which they interact are explained in a very clear-cut manner with reference to the respective response variables.

■ Nordson ASYMTEK’s new Helios SD-960
Series Automated Dispensing System

Nordson ASYMTEK introduces fluid dispensing system

Nordson ASYMTEK introduced the new Helios SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abra-sive thermal interface materials (TIM), silicones, epoxies, and grease for applica-tions such as potting, sealing, gasketing, and structural adhesives.





Techcon’s new valve controllers for the Smart Factory

Techcon introduced its new series
of smart valve controllers: the TS550R, TS560R, TS570R and TS580R. Equipped with a universal power supply, the new smart valve controllers are fully ‘plug and play’ and can be used immediately, anywhere in the world. The best-in-class smart controllers come standard with an Internet port and WiFi connection to allow users to monitor, record data and make precise parameter adjust-ments from remote location. This feature enables the units to fit into the Smart factory that requires Industry 4.0. In addition, troubleshooting and training can be done remotely through internet connection. The smart valve controllers feature an intuitive touchscreen interface for easy setup and operation. Dispensing parameters can be quickly dialed-in on the touchscreen The TS550R is a Smart Controller capable of controlling all Techcon pneumatic valve series. The TS560R is a Smart Spray Valve Controller capable of controlling all Techcon TS5520 series and TS5540 series spray valves. The TS570R is a Smart Auger valve controller capable of controlling all Techcon TS5000 and TS7000 series auger valves.

Electrolube’s first clear UL94 V-0 flame retardant PU resin

Electrolube has developed the long-awaited new UR5641 encapsulation resin. Technically, UR5641 almost defies convention and is very different from other resins that claim to be flame retardant and transparent. Traditionally, in order to obtain the desired flame retardancy resin manufacturers have used solid fillers to achieve flame retardancy but such fillers simply do not permit a transparent resin when cured. Traditional liquid flame retardants tend to be halo-genated, whereas Electrolube’s UR5641 does not contain any fillers and has the additional benefit of being halogen free. Conventional resins that claim to be flame retardant and optically clear are actually a pale amber when cured. Many of these resins are most likely to be based on epoxy technology which are prone to yellowing. Electrolube’s UR5641 is based upon aliphatic urethane chemistry, which is naturally resistant to the yellowing effects of natural light, making it useful for both exterior as well as interior applications. UR5641 cures to provide a flexible, protective and aesthetically pleas-ing covering over the luminaire elements.


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