New SMT Products – October 2018

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New: IPTE multi magazine loader/unloader

IPTE introduces the new multi magazine loader/unloader – an innovative solution for the end of line automation. The board handling components MLL 3P and MLU 3P are designed as multi magazine loader/unloader for loading or unloading production lines with processed or partially-processed PCBs. At the end or the start of the production line the PCBs are transferred from or into a rack. The central part of the loader/unloader is a servo driven conveyor shuttle that can pick up or store a PCB from any slot in one of the magazines. Therefor the cycle time and maintenance is dramatically improved by removing movement of the magazines. The system can hold three regular magazines. It is efficient, fast, productive and it operates very silent. The infeed/outfeed position can be freely programmed in both Z and Y position making it a perfect fit for any SMT line. The components MLL 3P and MLU 3P offer a lean design with optimized footprint. The solid frame is made from welded steel. A light curtain is used for safety allowing the operator to remove or insert magazines without any hassle.


CyberOptics’s multi-function SQ3000 with MRS Technology

CyberOptics Corporation demonstrated the MRS-Enabled SQ3000 with multi-process capabilities including 3D AOI, SPI and CMM applications at productronica India. The SQ3000 offers a combination of unmatched accuracy and speed with the industry-leading Multi-Reflection Suppression (MRS) sensor technology that meticulously identifies and rejects reflections caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for highly accurate measurement, making the proprietary MRS technology an ideal solution for a wide range of applications with exacting requirements. The Ultra-High Resolution (UHR) MRS sensor enhances the SQ3000 platform, delivering superior inspection performance, ideally suited for the 0201 metric process and micro-electronic applications where an even greater degree of accuracy and inspection reliability is critical.


Brewer Science unveils BrewerBOND and BrewerBUILD

Brewer Science, Inc. from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND family of temporary bonding materials, as well as the first product in its new BrewerBUILD line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address manufacturers’ evolving wafer-level packaging challenges. The BrewerBOND T1100 and BrewerBOND C1300 series combine to create Brewer Science’s first complete, dual-layer system for temporary bonding and debonding of product wafers. The new system was developed for power, memory and chip-first fan-out devices – all of which have stringent requirements with respect to temperature, power and performance. The system can be used with either mechanical or laser debonding methods. The BrewerBUILD material was specifically created for redistribution-layer (RDL)-first fan-out wafer-level packaging (FOWLP).


Engineered Material Systems’ electrically conductive adhesive

Engineered Material Systems debuts CA-188-1 low-temperature cure electrically conductive adhesive for die attach and general circuit assembly applications. CA-188-1 cures in 30 minutes at 80-degrees C, 20 minutes at 100-degrees C or 30 seconds at 150-degrees C with an electrical conductivity of 2 x 10-4 ohm-cm. This material is ideal for applications where the components are temperature-sensitive and require high conductivity interconnects. CA-188-1 has a 48-hour work-life and a 11,000 cP viscosity at 5rpm for easy needle dispensing or application by pin transfer. CA-188-1 was developed to pass the rigorous reliability requirements in die attach, disk drive, camera module, photonics and circuit assembly applications. It is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.


Koh Young’s KY8030-3 SPI SPI dispenses solder paste

Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Insufficient solder paste is a common defect in electronics assembly due in part to stencil design challenges stemming from component geometries and decreasing pad sizes. Increasing component density and tighter tolerances further complicate solder paste deposition. Insufficient solder can result in a weak solder joint, which will develop stress cracks on solder joints. The cost implications quickly accumulate, especially when multiple boards prototypes are manufactured in high volume. If defective, all the PCB must be cleaned, reprinted, or scrapped – all increasing production costs. Using the KY8030-3 SPI system to identify solder issues, and then dispense additional solder can eliminate these repair costs.


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