SEMICON West 2018: Beyond Smart
2017 was a banner year for the semiconductor industry. Sales boomed and significant opportunities emerged, driving near-record growth across every sector. However, with today’s ever-changing global business environment, uncertainty looms over the industry outlook. SEMICON West is where the industry goes to keep up with developments in a world that is rapidly moving BEYOND SMART — and where it goes to find the information and resources it needs to keep the good times rolling.
Why visit SEMICON West?
Three days of presentations with more than 80+ hours of technical and business programming, plus hundreds of exhibitors provide the insights, innovations, and intelligence to get ahead and embrace today’s disruptive landscape.
From materials, equipment, design, manufacturing, system integration, and demand channels to new verticals and adjacencies such as Flexible Hybrid Electronics, MEMS & Sensors, visitors will gain access to the best in the business and get a glimpse at what’s next. Immersive, new experiences demonstrating hot-buttons like Smart Transportation, Smart Manufacturing, MedTech, Big Data, IoT, and the cognitive technologies that are transforming the world make this year’s Expo unique.
Make the connection
SEMICON West connects the entire extended electronics supply chain — in one place, at one time. It’s the premier place to re-connect with your contacts and make new ones to drive your business forward. With all-new networking events, three new “Meet the Experts” Theaters, and new immersive Smart Pavilion experiences, this year’s Expo will help you connect with more qualified customers and partners than ever before.
Here are some of the unique products you will find on the show floor:
CyberOptics – Booth #6163
CyberOptics Corporation will demonstrate its next-generation Airborne Particle Sensor (APS3) 300mm with new ParticleSpectrum software.
CyberOptics’ WaferSense APS3 speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly detecting, identifying and monitoring airborne particles in real-time. With a thinner and lighter form factor to travel through semiconductor tools with ease, the APS3 offers leading accuracy and sensitivity valued by equipment and process engineers around the world.
The APS3 solution includes ParticleSpectrum software – a completely new, touch-enabled interface with user-friendly functionality, making it simple to read, record and review small to large airborne particle data. Easily identify when and where the particles originate and see the effects of cleanings, adjustments and repairs in real-time.
The Quadra 3 is an offline system designed for the high-mix production environment. It uses the same software platform and has the same ease-of-use as the other Quadra series machines. It uses a closed tube configuration, requiring no day-to-day maintenance or servicing.
Virtual Industries – Booth #924
Virtual Industries Inc. will demonstrate the ADJUST-A-VAC ESD Safe Kit and STEALTH-WAND ELITE Kit.
The ADJUST-A-VAC ESD Safe Kit With ESD Safe Delrin Small Parts Tips and ESD Safe Vacuum Tips (AV-6000-SP8-BD-110) allows the operator to adjust the vacuum level from just below atmospheric pressure to up to ten inches of mercury depending on the fragility of the part being handled. The vacuum tweezer system was developed as a result of customer concerns about manual handling of very thin/delicate substrates, wafers, MEMS devices and other very fragile components.
An integrated ten segment bar-graph-display visibly shows the vacuum level present during handling operations. Additionally, the vacuum port integrates a user replaceable inlet filter that protects operation of the tool from dust particles. Kits are available in 110 or 220 volt operation.
The STEALTH-WAND ELITE Kit (VVSW-NC-MW8) operates directly on 30 to 50 psi compressed air or nitrogen. The normally closed Stealth-Vac Elite vacuum pen contains a whisper quiet venturi vacuum generator that is activated only when the control button is depressed. This helps conserve factory compressed air when the tool is not in use.
YINCAE – Booth #5269
YINCAE has a wide range of materials varying from the World’s first commercial diamond underfill, to a high filler-load underfill that have the ability to flow into small gaps at room
temperature, a solder joint encapsulant paste that has low temperature reflow and high pull strength at high temperature (300°), a reflowable (filled) underfill that is excellent for micro-bump wafer level and last but not least, a mold underfill with a 90% filler load able to flow into 25μm gap without external force.
Yxlon – Booth #5880
Yxlon is extending an invitation to all visitors to bring their samples and speak with Yxlon experts about 2D and CT microfocus solutions that can cut costs and improve the efficiency of the inspection and test processes.
To reserve a time slot for free imaging and analysis, contact Rick Talbot directly at email@example.com, 408-643-1531.