SMT Association News – August 2018
22nd Microelectronics and Packaging Conference (EMPC) & Exhibition
September 16-19, 2019, Conference Center PISA Italy
Call for papers
Researchers and innovators in industry and academia are cordially invited to prepare to submit papers on the range of Microelectronics and Photonics Technologies, for oral or poster presentation at the Conference. Go to www.conftool.org/empc2019 to set up an account, then upload your Abstract and allocate it to the relevant topic heading. The Abstract must be informative – comprising a summary of the objective, the methodology and the results and include one or two graphics of your intended paper. Abstracts must not exceed 500 words and must be formatted as a single column.
The deadline for submitting Abstracts is 15th January 2019. If you have queries, please contact firstname.lastname@example.org.
Single Chip and Multi Chip Packaging, Wafer Level Packaging, 3D-WLP, 3D-IC, CoB, SiP, SoC, Systems-Integration Technologies, Embedded Passives on Wafers and Substrates, High Frequency and High Power Packaging, LTCC Technologies, Micro-Vias and Build-Up Technologies, Lab-on-Chip, Lab-on-Substrate, Molecular Electronics.
Inorganics, Organics, Co-fired, Flexibles, HD PCBs, Laminates, Printed, Microfluidics, Substrates Design and Technologies.
Thick and Thin Film Technologies, Wire Bonding, Bumping, Flip Chip Bonding, Cu/Low-k Wafers, Through Silicon Vias, Advances in Soldering, Adhesive Joining, Connectors.
MORE THAN MOORE
The future of IC shrinkage, the future options for IC packaging.
MEMS Based Sensors and Actuators Packaging, RF-MEMS, Optical MEMS, Bio-MEMS, WiFi modules.
Silicon Photonics, Power LED Assembly, Packaging and Light Guiding, Packaging of Optoelectronic Modules suitable for Gb/s Fibre Optic Communication, LiFi modules.
SOLAR ENERGY & PHOTOVOLTAICS
Packaging Design to improve Efficiency of Photovoltaic modules, Reliability and Qualification Approaches.
Smart Materials, Interconnections, Nano-Scale Packaging: Applications and Reliability.
Recovery and Recycling, Base material technologies.
Applications, Design, Development, Manufacturing that comply with complex and demanding regulations and market requirements.
Application in Consumer, Telecom, Automotive, Wearable, Space and Defence, Fuel Cells, Battery Technologies.
Wearables, Materials, Technologies, Applications, Markets, Reliability.
MANUFACTURING TECHNOLOGIES AND MATERIALS
Process Development, New Equipment, Clean Room Technologies, Yield Improvement, Cost and Cycle Time Reduction, Green Manufacturing, Micromachining, Dispensing, Printing, Deposition, Adhesives, Encapsulants, Underfills, Moulding Compounds, Advanced Solder Alloys, Halogen Free Materials, Dielectrics, Ceramics.
Electrical Modelling and Signal Integrity: Time and Frequency Domain Analysis of Interconnection and Packaging Technologies, Thermal Characterisation and Cooling Solutions, Modelling and Simulation Methodology for Characterisation of Advanced Packaging, Modules and Systems, Novel Cooling Techniques, Mechanical Modelling and Structural Integrity, Thermo-Mechanical Stress Analysis, Vibration and Shock Tests.
Techniques, Heatsinks, Heat pumping.
RELIABILITY and QUALITY
Specialised topics, Components, Counterfeits, Board and System Level Reliability Assessment, Failure Analysis, Interfacial Adhesion, Accelerated Testing, Reliability Engineering, Inspection and Test, Obsolescence Engineering, Prognostics.
Ambient Intelligence methods and products, Circuits and Systems, Touch Screen technologies.
Medical, Bio-Tec, Telecoms, Mobile, Smart Phones, RFID, Automotive, Aerospace, Robotics, Consumer, Structural
Electronics and Photonics, In-house or Outsource?, Markets, Supply Chain, Distribution, Microelectronics packaging and assembly industry
Short courses / tutorials
Proposals are invited from professionals to give 3-hour or 6-hour tutorials on:
- Automotive Electronics
- High Density Circuits
- MEMS & Microsystems
- Wire Bonding
- Soldering Solutions
To register your interest, please email your proposal to: email@example.com.
We will be glad to hear from leaders in the fields relevant to the Conference: Autonomous and Electrical Vehicles
- Advance Packaging
Please contact: firstname.lastname@example.org.