SMT / IPC Association News – May 2018

Don Dupriest to chair IPC Standards Committee

Don Dupriest, Lockheed Martin Missiles & Fire Control, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Dupriest succeeds Chris Mahanna of Robisan Laboratory, Inc., who held the role for IPC’s top standards development oversight committee for the past two years. As a Lockheed Martin Fellow on Lockheed Martin’s Technical staff, Dupriest provides leadership in interconnect technology development for electronic manufacturing and is responsible for advanced technology, process development and product manufacturability for electronic systems. An active IPC volunteer for more than 25 years, Dupriest has provided invaluable service to IPC. A previous chair of the TAEC, he is also a member of IPC’s Hall of Fame and President’s Award recipient. Dupriest currently co-chairs the IPC D-35 Printed Board Storage and Handling Subcommittee. Dupriest was elected to the TAEC post while attending a mentorship meeting for IPC Emerging Engineers. “I have to admit I was surprised to hear I was elected – I guess this is what happens when you miss your first TAEC meeting in twenty plus years,” he joked. “The committee voted to change the rules to allow a second term.” Dupriest added, “I am honored to be chosen and trusted by my peers to lead and serve as the first second term chairman of the TAEC.” Citing his goals for chairmanship, Dupriest stated, “I typically jump right in when approaching any task, so I plan to do that with the TAEC. We now have greater use of task groups within committees to speed up creating content and resolution of requirements under development, but there is always room for improvement. “I’d like to see what else we can do to better execute standards development by revising the Project Initiation Number (PIN) process for each new document at IPC. I’d like the process to better describe potential influences on other general committees and documents; i.e., requirements that might be impacted by the new PIN, giving general chairs a broader idea of activities outside their purview that may be impacted by new document development. I am also interested in keeping the communication lines open between general chairs so that we keep one another informed.” Mentioning his commitment to mentoring the next generation of engineers, Dupriest indicated his interest in bringing emerging engineers to TAEC meetings to give them an idea of what to expect once they are members of IPC. 

www.ipc.org/TAEC.aspx

North American PCB Industry Rebound Continues

IPC — Association Connecting Electronics Industries announced today the February 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Year-over-year shipment and order growth continued in February, and the book-to-bill ratio climbed to 1.17. Total North American PCB shipments in February 2018 were up 8.8 percent compared to the same month last year. This year to date, shipments are 9.3 percent above the same period last year. Compared to the preceding month, February shipments decreased 0.9 percent. PCB bookings in February increased 7.2 percent year-over-year, raising year-to-date order growth to 15.9 percent above the same period last year. Bookings in February were down 7.1 percent compared to the previous month. “The North American PCB industry continued its robust recovery in February, with positive year-over-year sales growth for the sixth consecutive month,” said Sharon Starr, IPC’s director of market research. “The outlook is also positive, based on strong order growth in recent months, and on the PCB book-to-bill ratio, which is above parity (1.0) for the 13th consecutive month and reached a new 12-year high in February.” 02_1820ipc20book-to-bill20graphs Detailed Data Available The next edition of IPC’s North American PCB Market Report, containing detailed first-quarter 2018 data from IPC’s PCB Statistical Program, will be available next month. The quarterly report presents detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by company size tiers, demand for prototypes, and other timely data. This report is available free to current participants in IPC’s PCB Statistical Program and by subscription to others. More information about this report can be found at www.ipc.org/market-research-reports. Interpreting the Data The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse. Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio. IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio at the end of each month. Statistics for the current month are normally available in the last week of the following month.

www.ipc.org

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