SMT / IPC / Electronics Manufacturing Association News – April 2018

IPC Honors Rockwell Collins and Northrop Grumman

IPC bestowed its highest corporate honors on two member companies, Rockwell Collins and Northrop Grumman Corporation. During a luncheon at IPC APEX EXPO 2018, the Peter Sarmanian Corporate Recognition Award was presented to Northrop Grumman and the Stan Plzak Corporate Recognition Award was presented to Rockwell Collins. The Peter Samarian Corporate Recognition award, named for a former IPC Board Chairman, recognizes an IPC-member company in the printed board industry that has supported IPC through participation in technical and management programs while providing leadership for the industry. Northrop Grumman, an IPC member since 1962, has long held a leadership role in IPC, participating in meetings for decades, making a significant impact on both IPC and the industry. More than 50 of its staff members are active on approximately 120 technical committees ranging from flexible circuits and fabrication processes to conflict minerals and intellectual property standards. Almost 1,000 Northrop Grumman employees have earned CIT, CIS, CID, CID+ and EMS certifications across all Northrop Grumman locations. Named for former IPC Board Chairman and founding member of the IPC Electronics Manufacturing Services Industry Management Council, the IPC Stan Plzak Corporate Recognition Award honors an IPC-member company in the electronics assembly industry that actively contributes to the industry while supporting IPC technical and/or management programs. Rockwell Collins has been a member of IPC since 1965, and has devoted many staff members to IPC standards development. Nearly 40 Rockwell Collins employees provide leadership and technical expertise on more than 100 standards development committees dedicated to topics such as assembly and joining, electronic documentation and e-textiles. More than 250 staff members have earned CIT, CIS, CID, CID+, and EMS certification across all Rockwell locations. “We are privileged to have Northrop Grumman and Rockwell Collins as members of IPC,” said John Mitchell, IPC president and CEO. “Their decades of leadership, commitment to providing staff resources to standards development, and engagement in IPC education and event activities, have contributed to IPC’s global growth in the electronics industry.” 

www.ipc.org

Linda and Tisdale earn Dieter Bergman IPC Fellowship Awards

Award honors two IPC members who have exhibited ongoing leadership In recognition of their ongoing leadership in developing and promoting IPC standards on a global basis, IPC – Association Connecting Electronics Industries® bestowed an Dieter Bergman IPC Fellowship Award upon Linda Woody, LWC Consulting, and Stephen Tisdale, Tisdale Environmental Consulting LLC at IPC APEX EXPO® 2018. This recognition is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry and embody the work ethic and spirit of the late Dieter Bergman, an industry pioneer and icon. Award recipients are eligible to bestow the Dieter Bergman Memorial Scholarship upon the university or college of his/her choice. Woody’s selection was University of Central Florida in Orlando and Tisdale selected the Thomas J. Watson School of Engineering at Binghamton University in New York. Linda Woody has supported IPC’s standardization efforts for more than 20 years and made her first technical presentation in 1997 on behalf of IPC. Since then, she has served on more than 40 IPC committees, chaired the 2-18d Printed Board Declaration Task Group and the Lead-free Electronics Risk Management consortia known as PERM and has been working on lead-free issues since the mid ‘90s. Woody has not only had a direct hand in drafting IPC documents, but has also participated in numerous round robin testing programs to collect data to support the requirements within the documents. Woody recently retired from Lockheed Martin after 36 years, serving as a member of the Lockheed Martin Production Technical Excellence staff, where she was a corporate subject-matter expert for electronics assembly and soldering processes. She now serves a president and CEO of her own consulting business. Stephen Tisdale, has been involved in the electronics industry for more than 40 years and with IPC standards development activities and initiatives for most of his career. He is a recognized content expert in the areas of environmental compliance, semiconductor packaging, PCB design, materials and assembly. While at Intel, Tisdale directed RoHS compliance implementation strategy, and technology compliance evaluations and set internal direction for halogen free strategies, and received a company excellence award for contributions to its lead-free program. Tisdale currently lends his talent and expertise on technical compliance issues on 30 IPC committees and serves as chair of the 4-34B Marking, Symbols and Labels for Identification of Assemblies, Components & Devices Task Group. He has also presented at past IPC APEX EXPO events and is a published author on several technical topics. “IPC and the entire electronics industry are fortunate to have both Linda and Stephen volunteer their time and expertise to IPC standards and program development,” said John Mitchell, IPC president and CEO. “Their work has enriched both the industry and IPC and we are thankful for their dedication.” 

www.ipc.org

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