What to Expect at SMTAi 2018 Conference Schedule

READ MORE: Global SMT & Packaging Magazine Volume 18 • Number 10 • October 2018 • ISSN 1474 –0893

Conference Schedule

 

READ MORE: Global SMT & Packaging Magazine Volume 18 • Number 10 • October 2018 • ISSN 1474 –0893

Conference Session E Exhibition H Harsh Environments L Lead-Free P Professional Development Course
S Special Event G Spotlight Session T Technical Innovations Symposium W Women’s Leadership Program

OCTOBER 14 • SUNDAY BOOTH
8:30am – 12:00pm P PDC 01: Design and Assembly Process Principles for High Density Flexible and Rigid Flex Circuits 50
8:30am – 12:00pm P PDC 02: Jump Start – An Introduction to SMT Process Basics and Troubleshooting – FREE TO ALL

ATTENDEES! 51
8:30am – 12:00pm P PDC 03: The Incredible Shrinking World Of Electronics – Are Traditional DFM, DFR, DFF Methods Obsolete? 52
8:30am – 12:00pm P PDC 04: Reflow, Wave and Rework Soldering Process Optimization in Electronics Manufacturing 40
8:30am – 12:00pm P PDC 05: Tin Whiskers: A 2018 State of the Industry Assessment . 53
1:30pm – 5:00pm P PDC 06: Utilizing IPC1782 – Component Traceability – To Reduce the Risk of Counterfeit Components,
Improve Quality, Increase Reliability, Decrease Costs, and Drive Product Innovation . 50
1:30pm – 5:00pm P PDC 07: Interconnections: PCB and Solder – Not Just Your Normal Failure Modes Any More 52
1:30pm – 5:00pm P PDC 08: Printing and Its Affect on Manufacturing Yield . 40
1:30pm – 5:00pm P PDC 09: New Developments in Selective Soldering Technology 53
1:30pm – 5:00pm P PDC 10: Solder Paste Qualification Using the SMTA Miniaturization Test Vehicle . 51

OCTOBER 15 • MONDAY
8:30am – 10:00am H HE1: Predicting Component Life for Harsh Environments 46
8:30am – 10:00am T TI1: Smart Manufacturing for Electronics . 48
8:30am – 12:00pm P PDC 11: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as
QFN, DFN and MLF in Tin-Lead & Lead Free World 50
8:30am – 12:00pm P PDC 12: Achieving High Reliability for Lead-Free Solder Joints – Materials Consideration . 53
8:30am – 12:00pm P PDC 13: Solder Joint Reliability – Principles and Applications 40
8:30am – 12:00pm P PDC 14: Weeding Out PCB Fabrication Defects Before Assembly: . 51
8:30am – 12:00pm P PDC 15: Defect Analysis and Process Troubleshooting: Part 1 52
10:30am – 12:00pm H HE2: Reliability of Lead-Free Solder Alloys in Automotive Environment . 46
10:30am – 12:00pm T TI2: Industry 4.0: Why Do We Need It? . 48
12:30pm – 1:30pm T TI Keynote Lunch – The Connected Enterprise – Make Smart Manufacturing Work for You 48
1:30pm – 3:00pm H HE3: New Materials and Methods for Electronic Products in Harsh Environments . 46
1:30pm – 3:00pm W Women’s Leadership Program: Presentations 47/49
1:30pm – 5:00pm P PDC 16: 10 Defect Analysis and Process Troubleshooting: Part 2 . 52
1:30pm – 5:00pm P PDC 17: Ball Grid Array: Design and Assembly of BGAs with Emphasis on Backward Compatibility. 50
1:30pm – 5:00pm P PDC 18: Design for Excellence II: Physics of Failure 51
1:30pm – 5:00pm P PDC 19: Reliability of Electronics – the Role of Intermetallic Compounds . 40
1:30pm – 5:00pm P PDC 20: Surface Finish Alternatives to HASL for PCB Applications . 53
2:00pm – 3:00pm T TI3: Blockchain and Predictive Field Reliability 48
3:30pm – 5:00pm H HE4: Improving Manufacturing Process To Provide Better Survivability of Electronic Products . 46
3:30pm – 5:00pm T TI4: Additive Manufacturing (3D Printing) for Electronic Circuitry 48
3:30pm – 5:00pm W Women’s Leadership Program: Table Topics Group Discussion 47/49
5:00pm – 6:00pm W Women’s Leadership Connection Reception . 47/49

OCTOBER 16 • TUESDAY
8:00am – 10:00am S Dual Keynote Presentation and SMTA Annual Meeting 21/22
10:00am – 5:00pm E Electronics Exhibition Exhibit Hall
11:00am – 12:30pm C APT1: Trends in Advanced Packaging / 3D Interconnects . 44
11:00am – 12:30pm C FSA1: Solder Paste Development to Overcome Component Challenges 49
11:00am – 12:30pm C MFX1: Solder Printing 46
11:00am – 12:30pm C SUB1: Electroless Nickel Immerison Gold Processing Considerations 48
11:00am – 12:30pm G Spotlight 1 . Exhibit Hall Theater
1:30pm – 3:30pm C APT2: Assembly and Reliability of Bottom Termination Components 44
1:30pm – 3:30pm C FSA2: Solder Paste Rheology, Performance and Aging . 49
1:30pm – 3:30pm C SUB2: Enhanced Copper Plating Technologies . 48

 

READ MORE: Global SMT & Packaging Magazine Volume 18 • Number 10 • October 2018 • ISSN 1474 –0893

 

Exhibitor List

COMPANY BOOTH
5N Plus Micro Powders . 927
Acculogic Inc. . 705
ACL Staticide, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 732
Aegis Software . 909
AGI Corporation . 800
AIM . 408
Akrometrix, LLC . 214
Allfavor Technology . 635
Alltemated, Inc. . 118
Alpha Assembly Solutions/ MacDermid . 1115
COMPANY BOOTH
American Hakko Products . 531
American Standard Circuits, Inc. . 700
Amerway Inc./Conecsus LLC . 228
Anda America & Hong Kong . 1023
AOI Systems Limited . 1211
Apex Tool Group -Weller . . . . . . . . . . . . . . . . . . . . . . . . . . . . 831
Ascentech LLC . 723
ASM Assembly Systems, LLC . 805
ASYS Group Americas Inc. . 431
Aven Tools, Inc. . 1118
COMPANY BOOTH
BEST, Inc. . 1132
BJ Electronics Co., Ltd. . 434
Blue Thunder Technologies, Inc. . 739
BlueRing Stencils . 911
BOFA Americas, Inc. . 801
Bosung Eng Co., LTD . 905
BTU International . 430
CAIG Laboratories, Inc. . 1136
CalcuQuote . 212
ChemCubed . 113
Circuits Assembly . 847
Clariant . 110
Cogiscan . 1218
Conductive Containers, Inc. . 1016
Creative Electron . 1224
Crystal Mark, Inc. . 1031
CTI Systems . 609
CyberOptics Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . 1026
Dimation . 1006
DP Patterning . 1008
ELANTAS PDG, Inc. . 515
Electrolube . 1039
Entrada Group . 834
EPS Worldwide . 626
EPTAC Corporation . 1012
ERSA North America . 616
Esdman Co., Ltd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 736
ESSEMTEC USA . 902
Eternity Technology Corp. . 701
Europlacer Americas . 1215
EVS International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .628
Fancort Industries . 840
FKN Systek . 1212
Fuji America Corporation . 407
Glenbrook Technologies Inc. . . . . . . . . . . . . . . . . . . . . . . . . . .329
Global SMT . 639
GPD Global . 517
GSC (Garland Service Company) . 532
Hanwha Techwin Automation Americas . . . . . . . . . . . . . . . . . .833
Harimatec Inc. . 932
HEPCO, Inc. . 418
Heraeus Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .808
IBL Technologies. 816
ICAPE Group . 134
I-Connect007 . 900
IDENTCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .941
Indium Corporation . 523
Inovaxe Corporation . 715
InsulFab PCB Tooling . 323
INVENTEC Performance Chemicals USA LLC . 1040
IPC . 747
ITW EAE . 615
JBC Tools USA Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .727
Juki Automation Systems . 839
Kester . 117
KIC . 124
Koh Young Americas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .815
KOKI Solder America . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .707
Krayden . 1036
Kwiktic . 525

COMPANY BOOTH
KYZEN Corporation . 623
Mentor Graphics Corporation . 933
Metallic Resources, Inc. . 534
METCAL . 330
MicroCare Corporation . 1015
MicroScreen LLC . 612
Mid-America Taping & Reeling, Inc. . 733
Mirtec Corporation . 208
MYCRONIC, Inc. . 1005
NCAB Group USA . 533
Nihon Superior Company, Ltd . . . . . . . . . . . . . . . . . . . . . . . . .511
Nikon Metrology, Inc. . 923
COMPANY . BOOTH
Nitto Kohki USA Inc. . 107
Nordson ASYMTEK . 311
Nordson Dage . 207
Nordson EFD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .109
Nordson SELECT . 412
Nortec Humidity . 634
NTS . 1228
Omron Inspection Systems . 709
Optical Control USA, LP . 702
Optilia Instruments . 735
Optimal Plus . 112
PACE Worldwide . 1028
PalPilot . 832
Panasonic Factory Solutions . 823
PARMI USA INC . 1123
PDR Americas . 527
Photo Etch Technology . 818
Pillarhouse USA, Inc.. 915
QUALITEK INTERNATIONAL, INC. . 334
Quantum Storage Systems . 632
Rehm Thermal Systems LLC . 409
Safari Circuits, Inc. . 1032
Saturn Electronics . 125
Scienscope . 229
Scoop . 1247
SEHO North America, Inc. . 423
Seica Inc. . 424
Seika Machinery, Inc. . 305
Senju Comtek Corporation . 416
Shenmao America, Inc. . 233
Simplimatic Automation . 731
Smart Sonic . 1206
SMT Today Ltd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1127
SMTA . SMTA1
SMTConnect . 947
SMTXTRA USA Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1010
SolderStar LLC . 806
Sonoscan, Inc. . 216
SPEA America, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .824
Specialty Coating Systems . 331
Spectrum SMT . 1312
Speedprint Technology . 116
StaticStop . 836
StenTech . 108
Super PCB . 931
Surfx Technologies . 309
TAGARNO USA . 1024
COMPANY BOOTH
Technimark, Inc. . 1216
Teradyne . 123
Test Research, Inc. . 224
TEXMAC Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .939
The Performance Review Institute . 114
Tintronics . 325
TopLine . 631
Transforming Technologies, LLC . 1041
U.S. Tech . 126
Universal Instruments Corporation . 1125
COMPANY BOOTH
Viscom Inc. . 315
VisiConsult X-Ray Solutions America Corp. . 826
VJ Electronix . 1210
V-Tek, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .232
WNIE Ltd. . 1315
Yamaha/Trans-Tec America . 223
YXLON International, Inc. . 810
ZESTRON Americas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .215
Zymet . 828

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