Alpha Assembly Solutions to present at 2016 IPC Assembly and Reliability Conference in Thailand and Vietnam

Alpha Assembly Solutions, producer of electronic soldering materials, will be presenting a technical paper “Methods for Minimizing Voiding in Surface Mount BGA and BTC Device Interconnects” at 2016 IPC Assembly and Reliability Conference which will be taken place in Thailand and Vietnam on April 26 and April 28 respectively.

The paper to be presented at IPC Thailand and Vietnam “Methods for Minimizing Voiding in Surface Mount BGA and BTC Device Interconnects” will be focuses on the evaluating the causes of voids and the methods of eliminating them. Voids are an area of concern for the long term durability and functionality of electronic devices. Voids near or at the interface of surface mount technology (SMT) component input/outputs (I/O’s), or the circuit board substrate can be highly probable initiators of crack propagation, leading to the high possibility of a field failure.

Six methods of reducing or eliminating voids in SMT applications will be discussed at these conferences. Three of the techniques are process based adjustments and three involve the optimization of materials used in solder paste. These methods include:

  • Reflow profile optimization
  • Use of vacuum during reflow
  • Managing the solder paste deposit volume through stencil design
  • Solder paste chemistry selection
  • Choice of solder powder particle size distribution
  • Use of solvent-free joining materials

For more information on Alpha’s vast product offering and capabilities, visit AlphaAssembly.com

TECHNICAL PAPER PRESENTATION:

Tuesday, 26 April 2016 | 15:15-16:00 | Bangkok, Thailand

Venue:            Miracle Grand Convention Hotel

Topic:             Methods for Minimizing Voiding in Surface Mount BGA and BTC Device Interconnects

Speaker: Tuck Weng Mok, Manager-Global Application Technology & Engineering, Alpha Assembly Solutions

 

Thursday, 28 April 2016 | 15:15-16:00 | Ho Chi Minh City, Vietnam

Venue:             Pullman Saigon Centre

Topic:             Methods for Minimizing Voiding in Surface Mount BGA and BTC Device Interconnects

Speaker: P.H. Tan, Senior Application Engineer, Alpha Assembly Solutions

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