CIRCUITS ASSEMBLY, PCD&F Announce 2018 NPI Award Winners

CIRCUITS ASSEMBLY and PRINTED CIRCUIT DESIGN AND FAB announced the winners of the 2018 New Product Introduction Awards for electronics assembly equipment, materials, software, and PCB fabrication.

The 11th annual NPI Awards recognizes leading new products during the past 12 months. An independent panel of practicing industry engineers selected the recipients.

The winners are:

Automation Tools Fuji America (Fuji Smart Nozzle Cleaner)
Coatings/Encapsulants Henkel Electronic Materials (Package-Level EMI Shielding Materials)
Component Placement – High Speed Europlacer Americas (Atom 4 Pick and Place Machine)
Component Placement – Multi-function Europlacer Americas (Atom 3 Pick and Place Machine)
Component Storage Inovaxe (InoAuto Smart MSD Cart)
Cored Wire Indium (Core 230-RC “No-Spatter” Robotic Cored Wire)
Device Programming Data I/O (UFS Upgrade Kit for Lumen X)
Dispensing Equipment Essemtec (Tarantula – Relentless All Terrain Jet Dispenser)
First Article Inspection Yxlon (Cheetah EVO Plus Scalable X-Ray Inspection System)
Process Control Tools Kyzen (Kyzen Analyst)
Process Innovation Panasonic Factory Solutions Co. of America (Panasonic SPV, Paperless Cleaning Technology)
Rework and Repair Tools Metcal (Connection Validation Robotic Soldering System)
Screen/Stencil Printing Equipment Juki (G-Titan Automatic Screen Printer)
Screen/Stencil Printing Peripherals/ Inovaxe (InoAuto Smart Stencil Rack)
Software – Process Control Cogiscan (Factory Intelligence – Analytics)
Software – Production BPM Microsystems (WhisperTeach)
Soldering Materials AIM (REL22 M8 High Reliability Solder Paste)
Soldering – Reflow R&D VaporTech (Smartphase Inline Vapor Phase Reflow System)
Soldering – Selective Nordson Select (Integra 508.5 Selective Soldering System)
Soldering – Other Promation (Quick 9440IR-U Soldering Robot)
Test & Inspection – AOI Test Research Inc. (TR7700Q 3D AOI System)
Test & Inspection – AXI Viscom (Inspection System X7056-II)
Test & Inspection – SPI CyberOptics (SE3000 SPI)
Underfill/Thermal Interface Materials Henkel Electronic Materials (Bergquist Gap Filler TGF 1500RW Liquid, Peelable TIM for Easy Rework)
Laminates Ventec USA (VT-5A2)
Wet Process Dow Electronic Materials (Microfill SFP Acid Copper)
AOI / Test Orbotech (Ultra Dimension)
Ink Jet Nano Dimension (DragonFly 2020 Pro 3D Printer)
Specialty Substrate Materials MacDermid Enthone (Systek THF)
Plating MacDermid Enthone (MacuSpec VF-TH 200)
Surface Treatment Nordson March (RollVIA Plasma System)
Factory Automation Software Mentor, a Siemens Business (Valor NPI, Intelligent DFM)

The awards were presented during a ceremony at IPC Apex Expo in San Diego.

“As the entries to this year’s NPI Awards demonstrate, there is a real move toward faster throughput right now,” said Mike Buetow, editor-in-chief of CIRCUITS ASSEMBLY and PCD&F. “This was noted by the judges, who were impressed with the trend to increase speed in the same machine footprint.”


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