Enthone publishes Semiconductor Wafer Level Packaging Guide

Enthone_WFLP_Brochure_cover_72dpiEnthone has published a semiconductor wafer level packaging (WLP) guide. The guide describes how key growth drivers have resulted in making WLP chemistry a critical component in helping wafer foundries, OEMs, and IDMs address the ever-changing industry landscape.

The WLP guide provides an overview of how Enthone supports the integration between Front-end wafer fabrication and Back-end assembly processes and discusses:

Eric Gongora, Global Director, Enthone Semiconductor Product Marketing said, “By collaborating with leading equipment and materials suppliers, Enthone co-develops advanced chemistries demanded by today’s highly competitive semiconductor market. Our collaborative model accelerates time to market, while aligning with our customers’ technology roadmaps.”

To obtain a copy of the guide, please email electronics@enthone.com



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