Forward Earnings Estimate of Advanced Semiconductor Engineering, Inc.(ASX)
Current year estimate on EPS consensus is $0.43. The Estimated EPS rate for Long term growth is $6.9. Advanced Semiconductor Engineering, Inc. reported better than expected with a surprise EPS of % or $ during its most recent quarterly earnings. The Actual EPS was $0.14 compared to the Estimated EPS of $.
Advanced Semiconductor Engineering, Inc. has a Price to Earnings ratio of 15.44 for the trailing twelve month period. The price to book ratio of the company for the most recent quarter is 1.82. For the Most Recent Fiscal Year, Advanced Semiconductor Engineering, Inc. has a price to cash ratio of 6.33. For the Trailing twelve month period, company showed a Net Profit Margin of 8.14% and Return on Equity of the stock is 13.63%.
For Dividend Investing Stock Market Traders Advanced Semiconductor Engineering, Inc. has a Dividend Yield of 3.04% with an Annual Dividend of $0.18. It has a Payout Ratio of 0.47 and the change in Dividend payout ratio is 0.03.
Advanced Semiconductor Engineering, Inc. (NYSE:ASX) witnessed a volatile trading activity on Thursday and eventually ended flat at 0% or 0 points without letting the bulls or bears take much advantage. The trading began at $6.07 and reached the intraday high at $6.09. The bulls started the profit booking and pushed the shares to intraday low of $6.02. The trading session was marked by a volume range of 1,313,475 shares exchanging hands. The 52-week high of the shares is $6.23 and the 52-week low is $4.395. The market cap of the company stands at $9,601 million and there are 1,594,812,700 shares in public circulation.
Several Stock Research Financial Advisors from Investment Banking firms have advised their client and investors on the stock.Advanced Semiconductor Engineering (ADR) was Downgraded by Goldman to Neutral on Nov 25, 2016.
Advanced Semiconductor Engineering, Inc. is an independent provider of semiconductor packaging services and semiconductor testing services, including front-end engineering testing, wafer probing and final testing services. The company offers packaging and testing services separately and on a turnkey basis. Turnkey services consist of integrated packaging, testing and direct shipment of semiconductors to end users designated by customers. The company is able to expand the traditional scope of turnkey services to offer total semiconductor manufacturing services to customers.