Global Flexible Printed Circuit Market – Forecasts from 2018 to 2023

The global flexible printed circuit market is anticipated to witness a compound annual growth rate of 12.72% during the forecast period to reach a total market size of US$30.897 billion by 2023, increasing from US$15.063 billion in 2017. The demand for flexible printed circuit will be led by manufacturers of smartphones, other mobile devices, LCD display, connectivity antennas, and rechargeable batteries. Increasing adoption of smartphones, rechargeable batteries and connectivity antennas will drive the demand for flexible printed circuits. Some of the other factors driving the demand for these circuits are rising consumption of consumer electronics in developing countries, increasing investment in IoT by major companies, and growing applications in the automotive sector among many others. Quality performance and high packaging flexibility of flexible PCBs will continue to make them highly preferred interconnectivity solutions in the near future.

This research study examines the current market trends related to the demand, supply, and sales, in addition to the recent developments. Major drivers, restraints, and opportunities have been covered to provide an exhaustive picture of the market. The analysis presents in-depth information regarding the development, trends, and industry policies and regulations implemented in each of the geographical regions. Further, the overall regulatory framework of the market has been exhaustively covered to offer stakeholders a better understanding of the key factors affecting the overall market environment.

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Identification of key industry players in the industry and their revenue contribution to the overall business or relevant segment aligned to the study have been covered as a part of competitive intelligence done through extensive secondary research. Various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others have been taken into consideration while conducting the secondary research. Both bottom-up and top down approaches have been utilized to determine the market size of the overall market and key segments. The values obtained are correlated with the primary inputs of the key stakeholders in the pressure sensors value chain. The last step involves complete market engineering which includes analyzing the data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting.

Market intelligence is presented in the form of analysis, charts, and graphics to help the clients in gaining faster and efficient understanding of the market.

Major industry players profiled as part of the report are LG Innotek, Amphenol- APC, Multi Circuit Boards, Ltd., Cirexx International, Inc., Wurth Elektronik GmbH & Co. KG, and All Flex Flexible Circuits, LLC among others.

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Companies Mentioned:

– LG Innotek
– Amphenol- APC
– Multi Circuit Boards, Ltd.
– Epec, LLC
– Flexible Circuit
– 3M
– Cirexx International, Inc.
– Wurth Elektronik GmbH & Co. KG
– AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
– All Flex Flexible Circui

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