Global Semiconductor Assembly and Packaging Services Market 2018-2022

Semiconductor assembly and packaging services are crucial in the semiconductor production process. The package of the semiconductor device is usually made of materials such as plastic, metal, and ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion.

The analysts forecast the global semiconductor assembly and packaging services market to grow at a CAGR of 4.87% during the period 2018-2022.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor assembly and packaging services market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
– Americas
– APAC
– EMEA

The report, Global Semiconductor Assembly and Packaging Services Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
– ASE
– Amkor Technology
– Intel
– SAMSUNG ELECTRONICS
– SPIL
– TSMC

Market drivers
– Rising number of fabs
– For a full, detailed list, view the full report

Market challenges
– Requirement of high initial capital investment
– For a full, detailed list, view the full report

Market trends
– Advances in wafer size
– For a full, detailed list, view the full report

You can request one free hour of the analyst’s time when you purchase this market report. Details are provided within the report.

For more information please click on:
https://www.researchandmarkets.com/publication/m8ahwcy/4522308

Commenting on the report, an analyst from the research team said: “One trend in the market is advances in wafer size. The semiconductor industry has seen a drastic transition in wafer size since 1910. The industry has migrated to large diameter wafers to cut down costs by almost 20%-25%. The industry presently uses 300-mm wafers to manufacture ICs.”

According to the report, one driver in the market is rising number of fabs. Semiconductor fabs manufacture a range of semiconductor devices and components. These components are either designed in-house by IDMs or manufactured as per designs provided by the client to foundries.

Further, the report states that one challenge in the market is requirement of high initial capital investment. The establishment of a whole manufacturing setup requires a significant amount of capital investment, as new fab costs on an average $3-4 billion. Therefore, companies that have comparatively low-scale production of ICs outsource the manufacturing to foundries and OSATs such as TSMC and ASE.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Companies Mentioned:

– ASE
– Amkor Technology
– Intel
– SAMSUNG ELECTRONICS
– SPIL
– TSMC

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