Henkel expands partnership with Ellsworth Adhesives through New Moldman Systems LLC Equipment Division

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Henkel’s TECHNOMELT® materials are a fast, low pressure alternative to conventional potting processes

Henkel Adhesive Technologies’ long-time business relationship with global distributor Ellsworth Adhesives has grown to now include Moldman Systems LLC, which was acquired by Ellsworth Corporation in 2014.  Henkel previously worked with Moldman Systems’ low pressure molding equipment through its former owner, but the new ties to Ellsworth Adhesives significantly expand worldwide sales and support opportunities. 

“For years, the combination of Henkel’s TECHNOMELT® low pressure molding materials and Mold-Man® equipment has delivered a fast and effective alternative to conventional potting processes,” explains Henkel Global Product Manager Circuit Board Protection, Art Ackerman.  “Now backed by Ellsworth Adhesives’ expansive global network, electronics customers around the world will have greater access to this novel encapsulation solution.”

www.henkel.com/electronics

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