Indium Corporation’s Jensen on achieving uniform solder bondline thickness
Indium Corporation announces the release of its newest informational video that discusses InFORMS®, a revolutionary product designed to achieve uniform bondline thickness for a stronger final solder joint.
This brief video features Indium Corporation’s Tim Jensen, Senior Product Manager for Engineered Solders, and SMT process expert Phil Zarrow, President and Principal Consultant for ITM Consulting, discussing the advantages of InFORMS. InFORMS are a fabrication in which braided, woven, or random-fiber metal substrate material is embedded into a solder preform. This technology is ideally suited for IGBT assembly of the DBC to the baseplate.
“The use of InFORMS provides confidence that the thermal performance will be repeatable from assembly to assembly, as well as across an individual assembly,” Jensen said. “You don’t have any part warping, or distortion of the part from hot spots in certain locations.”
This video can be found at www.indium.com/blog/phil-zarrow.
Jensen is an SMTA-certified process engineer. He has more than 15 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry.
Zarrow has been involved with PCB fabrication and assembly for more than 35 years. In addition to his background in automated assembly and cleaning, Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. His extensive hands-on experience also includes set-up and troubleshooting through-hole, and SMT processes throughout the world.