IWLPC Technical Committee announces Best Presentation & Papers Awards for 2015

General Chair, IWLPC 2015 Steven Xu, Ph.D. Qualcomm announces the Best of Conference, Best Presentation & Best Papers in WLP, 3D, MEMS program tracks  as chosen by the technical committee from the respective technical tracks based on technical merit, relevance, originality, knowledge of subject, quality of material and quality of presentation.

  • Best of Conference Paperis awarded to Lutz Hofman  of Fraunhofer ENAS

“3D Wafer-Level Packaging by using Cu-Through Silicon Vias for Thin MEMS Accelerometer Packages” 

 

  • Best of Conference Presentationis awarded to Chet Palesko of Savansys Solutions for the presentation entitled

“Technology and Cost Comparison of Electronic Packaging Methods”

  • Best of 3D trackis awarded to Tom Strothmann of Kulicke & Soffa for his paper on

“Methods for Assembly of TSV Products”

  • Best of WLP trackis awarded to Thomas Uhrmann  EV Group / Jose Campos NANIUM for their paper on

“Temporary Wafer Carrier Solutions for Thin FOWLP and eWLB-based PoP”

  • Best of MEMS trackpaper is awarded to Lutz Hofman  of Fraunhofer ENAS

“3D Wafer-Level Packaging by using Cu-Through Silicon Vias for Thin MEMS Accelerometer Packages” 

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