IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2018

The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees. Papers were evaluated based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.

The Best Presentation of Conference was awarded to Robert Hubbard, Ph.D., Lambda Technologies, Inc., for his presentation “Failure Relief in FOWLP Polymer Layers.”

Arnita Podpod, IMEC, won Best Paper of Conference for the paper “High Density and High Bandwidth Chip-to-Chip Connections with 20µm pitch Flip-chip on Fan-Out Wafer-Level Package” which also won the Best 3D Track Paper award.

The Best WLP Track Paper went to Jae Cho, Ph.D, GlobalFoundries, for “Chip Board Interaction Analysis of 22-NM Depleted Silicon on Insulator (FD-SOI) Technology in Wafer Level Packaging (WLP).”

The Best Advanced Manufacturing Track Paper was awarded to Habib Hichri, Ph.D., SÜSS MicroTec Inc., for the paper “Fine RDL Formation Using Alternative Patterning Solution for Advanced Packaging.”

All papers from the conference proceedings are available in the SMTA Knowledge Base as well as the IEEE Xplore Digital Library. The proceedings can also be purchased in the SMTA Book Store.

The technical committee is currently accepting abstracts for the 2019 conference. Abstracts are due March 1, 2019 and can be submitted online at http://www.iwlpc.com/call_for_papers.cfm.

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