Kulicke & Soffa receives market acceptance of its advanced packaging local reflow solution

Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “company”), a global leader in the design and manufacture of semiconductor and LED assembly equipment, announced that it has received its first purchase order for its APAMA™ (Advanced Packaging with Adaptive Machine Analytics) Advanced Packaging solution from a strategic, technology focused customer. The APAMA series is a single platform solution for Thermo-Compression (TC), High-Density Fan-Out Wafer-Level-Packaging and High-Accuracy Flip Chip applications.

“This purchase order is an important milestone in our Advanced Packaging platform initiative,” Tong Liang Cheam, Kulicke & Soffa’s Vice President of the Advanced Packaging Business Line and Corporate Strategy stated. “Designed for performance and accuracy, the K&S APAMA platform is positioned to enable the next generation of fine-pitch devices at the best cost of ownership.”

Introduced in 2014, the APAMA Series provides compelling throughput, placement accuracy, metrology, and overall cost-of-ownership advantages for the emerging Advanced Packaging market. Demand for enhanced performance, reduced form-factor and improved power efficiency, combined with challenges relating to die shrink are collectively driving the growth of the Advanced Packaging market. As the industry moves to adopt innovative packaging techniques, exciting new and meaningful growth opportunities are emerging for K&S.

Patrick Desjardins, Director of the Advanced Packaging Local Reflow Business Line stated, “Along with this first purchase order we continue to be deeply engaged with key customers as market interest for our Advanced Packaging solutions expands. The ability to address multiple application variants, coupled with a wide range of metrology capabilities adds meaningful production value and further differentiates our APAMA solution from the competition.”

K&S has also successfully qualified the APAMA TC Bonder at a large strategic customer and is preparing to deploy 10 additional APAMA TC Bonders for demo and evaluation purposes to customers in Taiwan, Korea, China, Singapore and United States over the coming months. The company continues to demonstrate the APAMA capabilities through its active customer sampling program. K&S application labs in Korea, Singapore, Taiwan and the United States are facilitating this program and are engaged with several leading customers.



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