Latest iNEMI Roadmap Chapters Cover Ceramic Interconnect & Photovoltaics, Connectors, and Passive Components
The International Electronics Manufacturing Initiative (iNEMI) has released three additional chapters from its 2019 Roadmap. The Ceramic Interconnect & Photovoltaics, Connectors, and Passive Components chapters are now available online, along with 13 additional chapters already published.
Ceramic Interconnect & Photovoltaics — This chapter provides an update on several key ceramic interconnect technologies, such as thick film, high and low-temperature co-fired, thin film, pure copper metallization on ceramic, and lead-free thick film. It provides direction on industry and technology needs including design tool, material and processing developments and cost reduction opportunities to address future market expectations in terms of performance and cost. Innovative ceramic interconnection substrate technology is a key enabling technology for mobile device applications, future networks (e.g., 5G), and IoT devices and applications. In addition, the chapter updates on the status of the photovoltaic industry and includes a section covering crystalline silicon solar cell design, fabrication and testing.
Connectors — Providing comprehensive information about electronic connectors, this chapter includes an overview of the current situation as well as projected technology enhancements and challenges over the 10-year roadmap horizon. It presents business, component, and substrate trends, and the impact of these trends on the manufacturing processes for surface mount, part placement, wave and selective soldering, press-fit and rework/repair.
Passive Components — The Passive Components chapter discusses technology needs and recommendations for capacitors, resistors, magnetics and circuit protection components, which are the highest volume passive components in electronic devices. They support power management, signal conditioning, and protection of active devices. This chapter, which was developed in collaboration with the Electronic Components Industry Association (ECIA), presents four areas of common cross-cut requirements: (1) environmental compliance with rapidly changing regulatory requirements, (2) component sensitivity to board mount conditions, (3) increased customer sensitivity to non-graceful failure modes of components, and (4) issues with counterfeit components. It also focuses on the specific needs for passives components in key markets such as automotive, medical and high-end systems.
The 2019 Roadmap is now available on the iNEMI website. It is free for iNEMI members and chapters are $500 each for non-members. Special pricing is available for non-profit organizations, including universities, research institutes and government agencies. For additional information: https://www.inemi.org/2019-roadmap-overview
For the 2019 Roadmap, chapters are being published in waves, with new chapters released every two to three weeks. The first four waves, already available online, included the following 13 chapters: Aerospace & Defense; Board Assembly; High-End Systems; Industrial Internet of Things; Mass Data Storage; Medical; MEMS & Sensors; Modeling, Simulation & Design Tools; Optoelectronics; Power Conversion Electronics; Semiconductor Technologies; Smart Manufacturing; and Sustainable Electronics.