Multilayer Printed Circuit Board Market to Attain Valuation of 26700 million US$ by 2025

Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.

Most PCB manufacturers are finding the demand for multilayer boards increasing by leaps and bounds. This growing demand is fed by the need for smaller, lighter boards for use in electrical devices, military equipment, healthcare miniaturization, and an expanding market for smart devices incorporated in home automation systems.

Smartphones and computers are perfect applications for multilayer PCBs with their need for compactness and light weight, yet sophisticated functionality.

Within the PCB market, the communication industry is expected to remain the largest market. Continuous innovations in smartphones and increasing demand from emerging economies are expected to spur growth for this segment over the forecast period.

The global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market is valued at 23000 million US$ in 2017 and will reach 26700 million US$ by the end of 2025, growing at a CAGR of 1.9% during 2018-2025.

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This report studies the global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market status and forecast, categorizes the global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market size (value & volume) by key players, type, application, and region. This report focuses on the top players in North America, Europe, China, Japan, Southeast Asia India and Other regions (Middle East & Africa, Central & South America).

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