Nihon Superior hosts anniversary celebration in Japan and begins its 50th year with new developments

Nihon Superior Tetsuro Nishimura 50th Anniv 16

Tetsuro Nishimura

Nihon Superior Co. Ltd., an advanced joining material supplier, is pleased to announce a great turnout for its 50-year anniversary celebration. The event took place at the Geihinkan Guest House of the Expo ’70 Commemorative Park. The celebration began with a sightseeing tour to Kyoto, followed by the anniversary celebration dinner with cask opening ceremony.

Approximately 150 guests from around the world attended the celebration. Several influential leaders at Nihon Superior gave speeches about the continued support the company has received since its start-up in 1966 when it began marketing unique flux products imported from the U.S. Since then, the company has made its mark by developing its own soldering materials and supplying them to the electronics industry. On the basis of its expertise in these technologies, Nihon Superior has developed a global business, establishing manufacturing and sales centers in Asia and forming business partnerships with companies in Europe, America and Asia.

Nihon Superior Cask Opening 16

Sake cask opening

After dinner, a special sake cask opening celebration took place. This ceremony is called the Kagami Biraki ceremony in which, historically, the fourth Tokugawa Shogun 300 years ago gathered his warriors before going to war to break open a sake cask. Since the battle was successful, this ceremony has been set for celebration of many auspicious events – in Nihon Superior’s case – the 50-year anniversary of the Japanese company.

Tetsuro Nishimura, President of Nihon Superior, commented, “Today we are able to celebrate our 50th anniversary, and this is due entirely to the support of our customers, partners and staff. I would like to express my thanks to every single person related to Nihon Superior. Our main product, SN100C®, is now widely known and has been listed in the world’s standard ISO9453:2014. We also now have the new SN100CVTM alloy that does not contain Ag, but is even stronger. We also have Alconano® for an alternative joining material for high-lead die bonding. We want to develop new markets and one of our target fields is those that have not yet started using lead-free or have given up on converting to lead-free solder.” Mr. Nishimura also explained that Nihon Superior plans to strengthen its developments based on recent research findings. The company’s mission is to continue to offer high-reliability joints to customers in the best possible way.

Toshiro Nishimura, Chairman and founder, recalled the days when he started the company by importing brazing alloys. Now with three generations – himself, his son and his grandson – working together, he mentioned, “There is nothing better than this. Thank you to everyone for your continuous support.”

www.nihonsuperior.co.jp/english

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