Plasma-Therm receives Singulator® MDS-100 order
Major imaging manufacturer implements plasma dicing
Plasma-Therm has received another order for its leading plasma die-singulation system, the Singulator® MDS-100TM, from a multinational manufacturer of imaging and optical products.
The system will be the first Singulator® MDS-100TM to be installed in Japan. Since its introduction in 2013, Singulator® MDS-100TM systems have been installed in the United States, Europe and Asia.
Plasma-Therm’s Singulator® line comprises the MDS-300TM for wafers up to 300mm (12 inch) diameter, and the MDS-100TM for wafers up to 200mm (8 inch) diameter. Both Singulator® systems process silicon wafers on industry-standard tape frames, and are capable of processing multiple wafer sizes without any process chamber modifications.
Singulator® systems are now in production for a range of devices, including power chips, LEDs, RFID, and IR image sensors, and they are being tested for 3D MEMS, III-V semiconductor, and CMOS devices, according to Thierry Lazerand, Plasma-Therm’s director of business development marketing.
“This new order shows that industry leaders recognize the quality and ROI of the PDOT (Plasma Dicing On Tape) approach offered by Plasma-Therm, “ said Lazerand. “This is a crucial step, especially for high- tech manufacturing in Japan and for the image sensors and peripherals segment, where device packaging quality and performance are paramount for digital cameras and other products.”
Plasma singulation, also called “plasma dicing,” is an enabling technology for continued improvement in device performance and increasingly demanding specifications for advanced packaging, in particular for WLCSP (wafer-level chip-scale package). Faster, more power-efficient devices, and shrinking product sizes, are driving chip manufacturers to use thinner wafers, smaller dies, and advanced packaging techniques such as 2.5D and 3D die stacking. For those technologies, plasma dicing has significant advantages over mechanical sawing and laser ablation die singulation.
Plasma dicing eliminates chipping and cracking caused by sawing, and avoids redeposited material from laser ablation. Plasma dicing produces stronger dies with reduced stress at corners. Plasma dicing also frees up valuable wafer area, because dies do not have to be placed on a strict grid, and plasma is compatible with non-rectangular die shapes. In addition, Plasma dicing increases throughput because entire wafers are singulated at once.