SemiGen increases contract manufacturing capability with new microwave and PCB assembly and test equipment

SemiGen, Inc. (www.semigen.net), an ISO and ITAR registered outsource for RF and Microwave contract assembly, automated PCB assembly (PCBA), wafer-processing, and key diodes, semiconductor devices, and bonding supplies, is pleased to announce that after moving into their new state-of-the- art facility, they’ve made an additional capital investment of over a half million dollars in new production, wafer fab, and testing equipment to support customer demand.

The new equipment consists of improvements across their entire service platform and includes: a new Mycronic MY300 pick and place system; two new Westbond wire bonders, a new Centrotherm eutectic vacuum chamber, new HTOL / HTRB ovens; as well as a new Disco DAD3220 dicing saw. In addition, they’ve made upgrades in their high-frequency testing department which includes several new pieces of performance testing and metrology tools.

“I’m excited to be in a position to continue to invest in and grow this important domestic outsource business,” said Tim Filteau, President of SemiGen. “Our CEO, Jim Morgan, has said we must do everything we can to help our customers augment their design, assembly, and hi-rel testing and up-screening capabilities, and it feels great to see this new equipment getting up and running to do just that.”

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