STI Electronics to exhibit at local SMTA Huntsville Expo
STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, will exhibit at the SMTA Huntsville Expo & Tech Forum, scheduled to take place Tuesday, April 11, 2017 at the Embassy Suites Hotel in Huntsville, AL. STI company representatives will discuss the company’s Training Resources and Engineering Services divisions.
STI is an IPC authorized training center for J-STD-001, IPC-A-610, IPC/WHMA-A-620, IPC-A-600 and IPC-7711/7721, and provides both Certified IPC Application Specialist (CIS) and Certified IPC Trainer (CIT) courses. STI’s Training Services division develops customized training courses to fit specific training needs. Typically, STI builds these classes around company-specific standards and specifications.
Other courses include basic soldering, wave soldering, ESD training, BGA rework and many more. It also provides operator/inspector training for through-hole and SMT soldering, conformal coating, and training to the requirements of NASA-STD-8739.1 and NASA-STD-8739.4 for Marshall Space Flight Center and its support contractors. In addition to its standardized training program support materials, STI Electronics’ Training Materials division provides unique or custom training materials including Fine Pitch Lead Free Solder Training Kits. STI is an approved distributor for IPC training materials.
From product design and manufacturability analysis to pre-production prototype and development, STI’s Prototype and Development Lab is a full-service design review and preproduction facility. STI’s Microelectronics Lab was established to meet the rising need for advanced systems development and assembly. STI’s Engineering Services division provides engineering support and specialized contract manufacturing services for the electronics manufacturing industry.
The Microelectronics Lab specializes in state-of-the-art engineering design including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as Imbedded Component/Die Technology (IC/DT).