Surface Mount Technology (SMT) Equipment – Global Strategic Business Report 2018

The global market for Surface Mount Technology (SMT) Equipment is projected to reach US$3.9 billion by 2022, driven by technological innovations in next generation electronics, rising demand for mobile communication devices, need for speed and flexibility in electronics manufacturing, and rise in the number of electronic contract manufacturers. Other major factors driving growth include stable R&D investments in electronics packaging and chip design and architecture; continued focus on miniaturization of electronic components; and increased adoption of automation technologies for more efficient assembling and packaging of electronic sub-systems. Strong adoption of advanced and highly efficient ‘pick & place’ machines especially bodes well for the growth of SMT placement equipment. Asia-Pacific represents the largest and the fastest growing market worldwide with a CAGR of 6.7% over the analysis period, led by booming electronics contract manufacturing sector in Southeast Asian countries; emergence of Taiwan and South Korea as hubs for semiconductor production, innovation and excellence; and strong domestic demand for electronic products and solutions.

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Summary of Findings

– Growing Competition and the Urgent Need to Increase Manufacturing Throughput and Reduce Time-to-Market Drive Automated SMT Assembly of Electronic Components
– Stringent Focus On Quality Control and the Ensuing Need to Minimize Defects Drive Adoption of SMT Equipment
– SMT Inspection Equipment Gains Traction as Focus Shifts from Detection of Defects to Prevention
– Reduced Board and Material Handling Costs Make SMT a Cost Effective Technology for Electronics Assembly and Packaging
– Developing Markets: The Focal Point for Future Growth

Geographic Markets Analyzed
US, Japan, Europe, Asia-Pacific, and Rest of World

Product Groups/Segments:
Screen Print Equipment (Manual Screen Print Equipment, Semiautomatic Screen Print Equipment, & Automatic Screen Print Equipment), Placement Equipment Market (High-Speed Placement Equipment, Medium Speed Placement Equipment, & Low-Speed Placement Equipment), Soldering Equipment (Reflow Oven, & Wave Oven), Cleaning Equipment, Inspection Equipment (Optical Inspection Equipment, X-Ray Inspection Equipment, & Laser Inspection Equipment), and Repair and Rework Equipment (Manual Repair and Rework Equipment, & Semiautomatic Repair and Rework Equipment).

How Can You Benefit?

This research project broadly covers analysis of all market trends, drivers, challenges and other macro market scenarios you need to know to improve your strategic planning and remain informed and competitive. The study also provides reliable ready facts and exclusive statistical data insights in addition to expert and highly accurate market size forecasts and projections to help you identify new markets and opportunities for revenue growth and sustainability. The extensive reportage of industry, company and product news and stories together with coverage of all major and niche players provided in the report helps you build a 360 degree perspective on your markets and gain unsurpassed insights needed to devise plans and strategies to maximize business growth.

The report profiles 69 companies including many key and niche players such as:

– ASM Assembly Systems GmbH & Co. KG (Germany)
– CyberOptics Corporation (US)
– Electro Scientific Industries, Inc. (US)
– Fuji Machine Manufacturing Co., Ltd. (Japan)
– Glenbrook Technologies, Inc. (US)
– Heller Industries, Inc. (US)
– Hitachi, Ltd. (Japan)
– Hitachi High Technologies Corporation (Japan)
– Illinois Tool Works, Inc. (US)
– Juki Corporation (Japan)
– Koh Young Technology, Inc. (South Korea)
– Kulicke & Soffa Pte Ltd. (Singapore)
– Mycronic AB (Sweden)
– Naprotek, Inc. (US)
– Nikon Metrology NV (Belgium)
– Nordson DAGE (UK)
– Omron Corporation (Japan)
– Orbotech, Ltd. (Israel)
– Saki Corporation (Japan)
– Teradyne, Inc. (US)
– Universal Instruments Corporation (US)
– Viscom AG (Germany)
– YXLON International GmbH (Germany)

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