TANAKA Denshi Group Factories are now IATF 16949 Certified for Bonding Wire
TANAKA Denshi announces that its factories in Malaysia, China and Taiwan, Singapore and Japan have successfully passed the required certification audits and meet the new IATF (International Automotive Task Force) 16949:2016 automotive standard. This new standard applies to all Automotive OEMS and suppliers and requires them to adhere to the highest system and process quality standards.
In making the announcement, William ‘Bud’ Crockett of TANAKA Denshi stated, “We are proud to have achieved this quality benchmark. Such certifications are a mark of distinction and achievement for our company. The IATF 16949:2016 automotive standard represents one of the strictest and most demanding certifications in the automotive industry.”
“This quality certification is important for all Tanaka Denshi automotive customers,” he added, “Because it demonstrates our dedication to highest quality.”
TANAKA bonding wire is typically used in the manufacture of power semiconductor packages as well as for welding of batteries and a host of applications found in the automotive industry. Attendees at the upcoming IPC/APEX show in January in San Diego can learn more in Booth #1253, where Bud will be on hand to answer technical questions and discuss what the certification means for TANAKA customers.