TopLine announces CCGA production expansion

TopLine has completed its move to a substantially larger lab and production facility for manufacturing CCGA solder columns and daisy chain test packages. The new facility is located in the City of Orange, California, in a convenient location, and is eight times larger than the previous facility.

In making the announcement, TopLine CEO Martin Hart stated, “This property creates a phenomenal opportunity for TopLine to continue its commitment to expand development and production of CCGA interconnects and test packages.” Hart believes that the new lab will provide sufficient room to expand production to one-million solder columns per month to better serve customers with quick delivery of standard products.

“In addition, this new lab, located near three major Interstate highways, gives customers easy access for design review meetings as well as access to FedEx and UPS for next-day shipments throughout the USA. It’s also close to such well-known landmarks as Angel Stadium of Anaheim, home of the Los Angeles Angels baseball team. The facility is also near three major colleges and universities, whose engineering faculty provides TopLine with a steady stream of educated personnel and capable manpower to fuel the company’s future growth.”

TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. “Many people are still unaware of the benefits that solder columns provide to reduce stress caused by CTE mismatch when interconnecting area array packages and the PC board,” Hart adds. For more information, and a quick chart of TopLine CCGA products, visit http://www.topline.tv/CCGA.html

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