ADLINK plays key role in update of PICMG’s COM Express® standard and associated type 7 pinout
New pinout design leverages low power, high performance processing and adds 10 GbE capabilities to industry-leading small form factor specification,
ADLINK Technology, Inc., a leading provider of embedded building blocks and Application-ready Intelligent Platforms (ARIPs) for the Industrial Internet of Things (IoT) and an Executive Member of PCI Industrial Computer Manufacturers Group (PICMG®), announced release of the new Type 7 pinout that is included in PICMG’s COM Express® standard update to version 3.0. The new Type 7 pinout was defined to leverage contemporary low power, server-grade silicon and introduce 10 Gigabit Ethernet (GbE) capabilities to the computer-on-module (COM) form factor. Customer applications benefitting from the Type 7 pinout include space-constrained systems in industrial automation and data communication, such as virtualization and edge computing, that require high density CPU cores balanced by reasonable power consumption.
ADLINK has played a leading role in the PICMG subcommittee that is currently defining the new COM Express 3.0 specification. The committee, which started its work in late 2015, is chaired by ADLINK’s Jeff Munch, CTO of Americas, and benefitted from the considerable efforts of
ADLINK’s team of technical contributors. The preview of the Type 7 pinout definition allows module manufacturers and customers to start designs before the full COM Express 3.0 specification is published, which is expected to be the end of Q3 2016.
“ADLINK has worked closely with fellow PICMG members to develop this latest module specification and pinout definitions to further extend the reach and usefulness of COM Express for evolving communications and automation applications,” said Wang. “The Type 7 pinout offers one more option to designers who are tasked with developing server-grade solutions that are easily upgradable and scalable and fit into compact spaces.”
The COM Express standard’s new Type 7 pinout, as compared to the Type 6 pinout, does away with all graphics support and replaces it with up to four 10GbE ports and an additional eight PCI Express (PCIe) ports, bringing the total PCIe support to up to 32 PCIe lanes. The Type 7 pinout has been specifically tailored to leverage all the functions of low power, headless server-grade System-on-Chips (SoCs) with a TDP below 65 Watts. In addition, the Type 7 pinout brings out 10GBase-KR signals, meaning the carrier board designer can choose between KR-to-KR, KR-to-optical fiber or KR-to-copper. A Network Controller Sideband Interface (NC-SI) bus is also supported, allowing for Intelligent Platform Management Interface (IPMI) Board Management Controller (BMC) support on the carrier board.
“On-going updates are critical to enable full-featured designs using any open specification, particularly one as accepted in the embedded vendor community as COM Express,” said Joe Pavlat, president and chairman of the PICMG consortium. “We greatly appreciate the active participation of members like ADLINK to lead these efforts.”
The preview of PICMG’s COM Express 3.0 Type 7 pinout definition is available for download to PICMG members on the PICMG website.