AIM introduces new J8 No Clean Jetting Solder Paste

AIM Solder, a global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the introduction of J8 No Clean Jetting Solder Paste. AIM has specifically formulated J8 No Clean Jetting Solder Paste for use in collaboration with a variety of jetting paste equipment manufacturers.

AIM’s J8 Jetting Paste has proven to provide consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining jetted paste deposits with printed paste deposits is required. J8 has a novel activator system providing powerful, durable wetting action accommodating a wide range of profiles producing bright shiny joints without graping defects. J8 has reduced voiding to as low as <5% on BGA and <10% on BTC ground pads.

The development of J8 No Clean Jetting Solder Paste is another example of AIM’s commitment to engineering state of the art products to address emerging PCBA manufacturing technologies.

For more information on AIM’s new J8 No Clean Jetting Solder Paste, please visit the website


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