Alpha introduces ultra-low voiding solder paste for increased process reliability
Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA® OM-358, a lead-free, zero-halogen solder paste designed to provide ultra-low voiding performance on all component types, including bottom terminated components.
“ALPHA® OM-358 was designed to enhance process benefits through best-in-class voiding performance”, said Paul Salerno, Global Portfolio Manager for SMT Assembly at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses. “When using a high soak profile, ALPHA® OM-358 produces an average voiding of below 10%, with consistent control of void distribution for increased process stability, elimination of rework, and enhanced electrical and thermal performance of a customer’s end product”.
ALPHA® OM-358 exhibits excellent resistance to electrochemical migration on fine pitch components which makes it ideal for high reliability applications such as Automotive (powertrain, in-cabin electronics & sensors), LED, Medical and Defense.
For more information on ALPHA® OM-358, visit the Alpha website.