Atotech to present new products for flex/flex-rigid PCB production to serve current market demand at KPCA 2018
At KPCA Show 2018, held in Gyeonggi-do from April 24 to 26, Atotech will showcase its latest production solutions for flex/flex-rigid and other PCB types at booth #J201. Next to its product promotion at the trade show booth, the company takes part in the technical conference (hall 7, Kintex 2) with the presentation of two papers.
On Wednesday, April 25, from 3:00 to 4:00 pm, Frank Bruening, Global Business Manager for desmear and metallization at Atotech Deutschland GmbH, will present Printoganth® RA, Atotech’s novel electroless copper process for high-end flex and flex-rigid PCBs on super flexible RA copper foil. The presentation will be held in room 1 in exhibition hall 7, Kintex 2.
On Thursday, April 26, from 1:30 to 2:30 pm, Sukyoung Kim, Sales and Product Marketing Manager Atotech Korea Ltd., will present InPro® SAP3, a process which allows for excellent within-unit distribution at high current density. Visitors can follow his presentation in room 1, Exhibition Hall 7, Kintex 2.
Printoganth® RA is a horizontal electroless copper process for next generation flex and rigid-flex PCBs. The process enables a uniform electrolytic copper deposition with a shiny surface appearance for reliable automated optical inspection (AOI). Due to constant, low tensile internal stress, it provides blister-free coverage and excellent adhesion on polyimide surfaces.
InPro® SAP3 is a DC copper plating electrolyte for IC Substrate BMV filling. It uses insoluble anodes in vertical conveyorized systems (VCP). The process offers reliable via filling results and achieves excellent within-unit distribution at high current densities.
For further questions on these or other products, visitors to the show are invited to join Atotech’s paper presentations or pass by the Atotech booth #J201 during the KPCA Show from April 24 to 26. Local and international specialists will be on site to discuss any question or inquiry.