Engineered Material Systems introduces a new UV cure adhesive

Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, is pleased to debut its 535-11M-12 UV cured epoxy formulated for disk drive, camera module, optoelectronic and circuit assembly applications. The epoxy has been designed to pass rigorous reliability requirements.ecm-dam-fill-encapsulants

535-11M-12 is a screen printable version of the 535-11M-7 UV cure adhesive. The material is designed to eliminate any warpage in electronic assemblies and can be used in other bonding applications in fiber optics and camera modules. The material also can be used for lens bonding, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.

This new non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-11M-12 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony.

535-11M-12 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the 535-11M-12 UV curing adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit


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