Engineered Materials Systems introduces low-temperature cure conductive adhesive for static drain and EMI/RFI shielding applications
Engineered Materials Systems, a global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications.
EMS 618-116 is designed to cure in 30 minutes at 100°C or rapidly at elevated temperatures. EMS 618-116 forms high-strength, high-reliability conductive interconnects.
The EMS 618-116 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications.
For more information about the EMS 618-116 Room Temperature Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit the website.