Flextron announces powerful X-ray inspection, failure analysis capability

Flextron Circuit Assembly, a full-service contract electronics manufacturer, announces the availability of 3D X-ray imaging capability, through the acquisition of a Nikon XTV-160 system that provides Flextron with a powerful quality assurance and diagnostic tool. “Flextron has 3D X-ray capacity that enables us to examine BGA spheres, for example, with great precision,” states Jay Vora, VP Sales and Engineering, in making the announcement. “We also use this powerful quality assurance and failure analysis system to analyze leadless packages, wire bonds, PTH via fills, solder joints, molded parts, lead frames, and much more in a circumferential and tilting pattern. This enables detailed analysis, thus ensuring process quality from lot to lot for our customers.”

The XTV-160 is specifically designed for use in production lines and failure analysis laboratories. With a precision joystick, system users control the 5-axis sample manipulator. Real-time X-ray allows users to intuitively navigate complex printed circuit boards and electronic components and quickly trace defects. In automated inspection mode, samples can be inspected at highest throughput.

“For us,” Jay adds, “The XTV-160 is an easy-to-use, cost-effective and high-quality PCBA inspection system. Because component connections on today’s compact and densely-populated PCBs are hidden by other components, X-ray becomes the only viable inspection solution for these hidden features.”

In automated inspection mode, samples can be inspected at the highest throughput. In manual mode, intuitive software and high-precision sample manipulation enable operators to visualize and evaluate the tiniest internal defects and deficiencies in components including micro-BGAs.

Applications for the XTV-160 at Flextron include solder reflow analysis, BGA connectivity and analysis, solder void calculation, through-hole measurement and inspection, die attach voiding measurement, ball bond analysis, stitch bond analysis, pad array analysis, dry joint detection and analysis, chip-on-chip analysis, and more. For more information, contact Jay Vora at Tel.: (630)766-1000 x 200, or email: jay@flextronassembly.com

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