Further development of GOEPEL electronics Boundary Scan integration into SPEA ICT system
GOEPEL electronics announces the availability of Boundary Scan integration into SPEA’s multi-core ICT (In-Circuit-Test) platform. With the level of integration provided for the SPEA3030 ICT, execution of interactive Boundary Scan tests is now possible on all cores of the ICT (up to four). This results in maximization of parallelism and productivity.
Implementation in the multi-core system now offers even higher throughput for the test process. Parallel work and simultaneous execution of different test sequences opens up technological and economic advantages. Various types of projects including parallel test of several UUTs (Unit under Test) can be handled easily.
The Boundary Scan integration option from GOEPEL electronics has been available in selected in-circuit test systems by SPEA for several years. The Boundary Scan hardware architecture has been integrated into the ICT adapter system with the system software CASCON. The combination of ICT and Boundary Scan test procedures makes for the highest test coverage possible.
The new integration enables real parallel test execution involving all resources of the SPEA3030 ICT. The SPEA software LEONARDO initializes the tests of the Boundary Scan software CASCON, which is able to activate measurement and driver instruments of the ICT. Thereby a real interaction between Boundary Scan and the individual ICT cores is achieved. CASCON then transfers the test results to the SPEA software and assigns them to the respective cores.