Global Electronic Packaging Materials Industry Projected to Reach 6110 Million US$ by 2025

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This study focuses on the production side and consumption side of Electronic Packaging Materials, presents the global Electronic Packaging Materials market size by manufacturers, regions, type and application, history breakdown data from 2013 to 2018, and forecast to 2025.

In terms of production side, this report researches the Electronic Packaging Materials capacity, production, value, ex-factory price, growth rate, market share for major manufacturers, regions (or countries) and product type.

In terms of consumption side, this report focuses on the consumption of Electronic Packaging Materials by regions and application. The key regions like North America, Europe, Asia-Pacific, Central & South America, Middle East and Africa etc.

This report studies the Electronic Packaging Materials market.

Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.

Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.

In 2017, Global Electronic Packaging Materials total market size was 4885.6 Million USD, with a steady growth in recent years, according to QYR analysis, the market is expected to reach 6104.9 Million USD by the end of 2023. One of the salient features of Electronic Packaging Materials market is the cooperation with downstream Semiconductor & IC and PCB manufactures, especially for large companies in this industry.

Geographically, the consumption market is leading by Greater China and United States, Europe and Japan. In terms of year 2017, Greater China holds the largest market share, with about 1975.5 Million USD sales revenue, followed by United States, with about 14.76% market share in 2017. China will keep playing important role in Global market.

The Electronic Packaging Materials market was valued at 4890 Million US$ in 2017 and is projected to reach 6110 Million US$ by 2025, at a CAGR of 2.8% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for Electronic Packaging Materials.

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This report includes the following manufacturers; we can also add the other companies as you want.

  • DuPont
  • Evonik
  • EPM
  • Mitsubishi Chemical
  • Sumitomo Chemical
  • Mitsui High-tec
  • Tanaka
  • Shinko Electric Industries
  • Panasonic
  • Hitachi Chemical
  • Kyocera Chemical
  • Gore
  • BASF
  • Henkel
  • AMETEK Electronic
  • Toray
  • Maruwa
  • Leatec Fine Ceramics
  • NCI
  • Chaozhou Three-Circle
  • Nippon Micrometal
  • Toppan
  • Dai Nippon Printing
  • Possehl
  • Ningbo Kangqiang

Market Segment by Product Type

  • Metal Packages
  • Plastic Packages
  • Ceramic Packages

Market Segment by Application

  • Semiconductor & IC
  • PCB
  • Others

About Us:

QY Research established in 2007, focus on custom research, management consulting, IPO consulting, industry chain research, data base and seminar services. The company owned a large basic data base (such as National Bureau of statistics database, Customs import and export database, Industry Association Database etc), expert’s resources (included energy automotive chemical medical ICT consumer goods etc.


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